In a decoupling application, decoupling capacitor proximity and placement near the decoupling pin can affect decoupling performance. The IPDiA dedicated vertical silicon capacitors family solves these issues. They are designed with the bottom electrode to be connected to ground and the top electrode suitable for the wire-bonding. Good electrical and decoupling performance and high voltage ratings, together with mechanical design and wire-bonding, make this family ideal for any application where high stability and close by decoupling is required such as RF power transistor drive decoupling, plus high and very high speed, sophisticated designs both on a PCB as well inside a SIP (system in package), and/or MCM (multi-chip modules).