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3D-Slide6

The dedicated family of silicon capacitors, in the square format with four pads instead of two for the JEDEC format compatible devices, are specifically designed for embedded and wire-bonding applications. These are available in 250µm thickness as well as 100µm for the low profile EMSC range, and under by request. High performance and high stability over the temperature range of -55° to 250°C, combined with suitable wired-bonding mounting, makes this family a good choice for extreme temperature applications such as down-hole and geo-thermal measurement and supervising. Pad finish is aluminum, copper pads for embedding or gold pads for wire-bonding are available on request.

PTM Published on: 2012-12-19