IPDiA is located in Caen, Normandy, France. It is a spin off of Philips semiconductor and has more than fifty years of success in the semiconductor industry, with exclusive focus on 3D silicon passive devices in recent years. The dedicated campus includes IPDiA’s headquarters, research and development team, sales and marketing organization, and the fully owned six inch wafer fabrication facility. The IPDiA core activity is integration of the passive devices into silicon, with patented technology called PICS (passive integration connecting substrate), using the Z-dimension of the silicon wafers to produce high-density capacitors, termed 3D Silicon in the most of the company communications. By leveraging the highly mastered semiconductor manufacturing process, IPDiA establish a unique business model suitable both for the small/medium production volumes as well as for high product quantities delivering more than one billion pieces per year.