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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects
CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.
Part List
| Billede | Manufacturer Part Number | Beskrivelse | Tilgængeligt antal | Pris | Vis detaljer | |
|---|---|---|---|---|---|---|
 |  | 3800520001 | CONN SPRING MOD 25POS SMD | 35 - Immediate | $622.59 | Vis detaljer |
|  | 3800520013 | CONN SPRING MOD 51POS SMD | 0 - Immediate | $548.34 | Vis detaljer |
|  | 4631533093 | CABLE FFC/FPC 25POS 0.64MM 3" | 3 - Immediate | $529.39 | Vis detaljer |
