Indstillinger
Hurtig levering
Gratis levering
Incoterms
Betalingstyper
Markedspladsprodukt
THERM-A-GAP™ GEL T630 Dispensable Thermal Interface Material
Parker Chomerics' THERM-A-GAP GEL T630 with 0.7 W/m-K thermal conductivity, single component, fully cured dispensable thermal interface material
Parker Chomerics' THERM-A-GAP T630 gel is a highly conformable, pre-cured, single-component compound with 0.7 W/m-K thermal conductivity. The cross-linked gel structure provides superior long-term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.
Features and Benefits
- Dispensable
- Fully cured
- Highly conformable at low pressures
- Reworkable
- No refrigeration, mixing, or filler settling issues in storage
- Single dispensable TIM can eliminate multiple pad part sizes/numbers
Applications
- Engine control
- Transmission control
- Braking/traction control
- Power conversion equipment
- Automotive electronic control units (ECUs)
- Power semiconductors
- Televisions and consumer electronics
- MOSFET arrays with common heatsinks
- Power supplies and uninterruptible power supplies
Attributes
- General use material
- Good thermal performance
- Years of proven reliability in high-volume automotive applications
- Minimal stress on components
- Lowest deflection force required
Published: 2018-10-25
