Indium Corporation

Indium6.6HF Water-Soluble Solder Paste

Indium6.6HF water-soluble solder paste from Indium is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window

Image of Indium Indium6.6HF Water-Soluble Solder PasteThe Indium6.6HF from Indium is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.

Features
  • Low-voiding water-soluble flux for solder paste:
    • Reduced largest voids
    • Fewer voids
    • Minimized voiding overall
    • For BGA, CSP, and bottom termination components, such as QFNs and DPAKs
  • Wide reflow process window
  • Excellent wetting on a variety of surface finishes
  • Exceptional printing process window:
    • Excellent response-to-pause
    • Long stencil life
    • Prints consistently at a wide range of speeds
  • Maintains tack over time
  • Outstanding cleanability
Applications
  • Consumer
  • Industrial
  • Medical
  • Military

Indium6.6HF Water-Soluble Solder Paste

BilledeManufacturer Part NumberBeskrivelseTilgængeligt antal PrisVis detaljer
6.6HF SAC305 T4 WATER SOLUBALEPASTEOT-801641-C0066.6HF SAC305 T4 WATER SOLUBALE0 - Immediate$1,588.22Vis detaljer
Published: 2025-10-20