Electrically Conductive Gasket Tape MSG6000F Series

3M™ Electrically Conductive Gasket Tape MSG6000F Series consists of conductive fabric, highly conductive gray foam, and black pressure-sensitive adhesive (PSA). It offers excellent grounding performance between substrates and also has high EMI shielding performance. The PSA tack properties make 3M tape series MSG6000F easy to use in assembly operations and offers good adhesion to common metals such as copper, aluminum, stainless steel, and smooth conductive substrates.

3M tape series MSG6000F is designed for use in applications requiring good conductivity, compressibility, and resilience. This tape series will help secure a reliable conductive connection for ESD grounding or form a close conductive enclosure to achieve good EMI shielding performance.

The MSG6000F series is effective for EMI shielding over a wide range of frequencies from several tens of megahertz to tens of gigahertz. This tape series is a great solution for many mobile handheld devices, including mobile phones, portable digital cameras, and laptops, that need grounding reinforcement or better shielding.

3M Electrically Conductive Gasket Tape MSG6000F Series has three thickness options. Standard width is 400 mm.

Application Guide

The bond strength of 3M Electrically Conductive Gasket Tape MSG6000F Series depends on the amount of adhesive-to-surface contact developed during application, the substrate type, and surface conditions.

1. Firm application pressure helps develop better wet-out and adhesive contact and may lead to improved bond strength as well as electrical conductivity. Pressure must be applied to the bond area after assembly to ensure sufficient wet-out of the adhesive to the substrates and to engage the conductive acrylic adhesive fillers with the substrates to make an electrical connection. Mechanical pressure (roller, metal bar) or finger pressure at 5 psi to 15 psi. [Optimally the application conditions are determined via a set of design of experiments (DOE) using a range of application pressure, dwell time, and temperatures (suggested initial range might include 5 psi to 15 psi, 2 to 5 seconds, +21°C to +38°C).]
2. Heat may be applied simultaneously with pressure to improve wetting, final bond strength, and electrical conductivity. Suggested temperature range to evaluate is in the +38°C to +60°C range.
3. To obtain optimum adhesion, the bonding surfaces must be clean, dry, and well unified. Two typical surface cleaning solvents are isopropyl alcohol and heptane.
4. Adhesion builds with time, up to 24 to 72 hours may be required to reach final adhesion values. Note: Carefully read and follow the manufacturer's precautions and directions for use when working with solvents. Tape application below +10°C (+50°F) is not suggested. Once properly applied, low temperature holding power is generally satisfactory.