Digi XBee® ZigBee® (S2C) Through-Hole
Digi's embedded ZigBee modules provide OEMs with a simple way to integrate mesh technology into applications
Digi's XBee and XBee-PRO ZigBee RF modules provide cost-effective wireless connectivity to electronic devices. They are interoperable with other ZigBee PRO feature set devices, including devices from other vendors. XBee and XBee-PRO ZigBee modules are ideal for applications in the energy and controls markets where manufacturing efficiencies are critical.
Digi currently offers a through-hole XBee ZigBee module that uses the Silicon Labs EM250 transceiver. With this release, the XBee ZigBee through-hole module will be available with the EM357 transceiver. The EM357 transceiver is faster, has lower current draw, and has significantly more RAM and Flash. These advanced features allow EM357-based modules to support more child nodes, handle more network traffic, have more memory for code updates, and operate more efficiently. This release rounds out the EM357-based XBee ZigBee module offering with both through-hole and surface-mount form factors.
For current customers interested in taking advantage of these performance improvements, the XBee Zibee migration guide will assist with migrating from the EM250-based XBee ZigBee modules to the EM357-based XBee ZigBee modules.
XBee ZigBee new product notice
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