Digi XBee® ZigBee® (S2C) Through-Hole

Digi's embedded ZigBee modules provide OEMs with a simple way to integrate mesh technology into applications

Image of Digi's XBee® ZigBee® (S2C) Through-HoleDigi's XBee and XBee-PRO ZigBee RF modules provide cost-effective wireless connectivity to electronic devices. They are interoperable with other ZigBee PRO feature set devices, including devices from other vendors. XBee and XBee-PRO ZigBee modules are ideal for applications in the energy and controls markets where manufacturing efficiencies are critical.

Digi currently offers a through-hole XBee ZigBee module that uses the Silicon Labs EM250 transceiver. With this release, the XBee ZigBee through-hole module will be available with the EM357 transceiver. The EM357 transceiver is faster, has lower current draw, and has significantly more RAM and Flash. These advanced features allow EM357-based modules to support more child nodes, handle more network traffic, have more memory for code updates, and operate more efficiently. This release rounds out the EM357-based XBee ZigBee module offering with both through-hole and surface-mount form factors.

For current customers interested in taking advantage of these performance improvements, the XBee Zibee migration guide will assist with migrating from the EM250-based XBee ZigBee modules to the EM357-based XBee ZigBee modules.

ZigBee RF modules

XBee ZigBee new product notice

XBee ZigBee migration guide

Features
  • Interoperable with other ZigBee-compliant devices
  • Programmable versions with on-board microprocessor enable custom ZigBee application development
  • Supports binding and multicasting for easy integration into a home automation platform
  • Through-hole and surface-mount form factors enable flexible design options
  • 15 general-purpose I/O lines
  • Link budgets of 110 dB for XBee and 119 dB for XBee-PRO ZB
  • Industry-leading sleep current of sub 1 µA
  • Firmware upgrades via UART, SPI, or over the air
Published: 2015-08-05