Heat Sinks

Results: 123.755
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123.755Results

Showing
of 123.755
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V7236B1
HEATSINK TO-220 19.05X13.21MM
Assmann WSW Components
49.456
In Stock
1 : kr.2.18000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
-
-
24.00°C/W
Aluminum
Black Anodized
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
37.466
In Stock
1 : kr.2.18000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
274-1AB 345-1023
HEATSINK TO-220 LOW HEIGHT BLK
Wakefield Thermal Solutions
23.182
In Stock
1 : kr.2.24000
Bulk
Bulk
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
2.0W @ 56°C
8.00°C/W @ 400 LFM
28.00°C/W
Aluminum
Black Anodized
V8508A
HEATSINK TO-220 19X12.80MM
Assmann WSW Components
33.661
In Stock
1 : kr.2.75000
Bulk
-
Bulk
Active
Board Level
TO-220
Press Fit
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
3.0W @ 60°C
14.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
574502B00000G
HEATSINK TO-220 VERT MNT .75"
Boyd Laconia, LLC
48.323
In Stock
1 : kr.2.88000
Bag
-
Bag
Active
Board Level
TO-220
Clip
Rectangular, Fins
0.750" (19.05mm)
0.860" (21.84mm)
-
0.395" (10.03mm)
3.0W @ 60°C
8.00°C/W @ 400 LFM
21.20°C/W
Aluminum
Black Anodized
6.640
In Stock
1 : kr.3.07000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
V8508B
HEATSINK TO-220 19X12.8MM
Assmann WSW Components
6.530
In Stock
1 : kr.3.07000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Press Fit and PC Pin
Rectangular, Fins
0.748" (19.00mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
2.0W @ 40°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
4.573
In Stock
1 : kr.3.65000
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
V-1100-SMD/A-L
HEATSINK TO-263 12.70X26.20MM
Assmann WSW Components
23.615
In Stock
1 : kr.3.71000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.031" (26.20mm)
-
0.390" (9.91mm)
-
-
23.00°C/W
Copper
Tin
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
42.561
In Stock
1 : kr.3.78000
Cut Tape (CT)
250 : kr.2.80296
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
26.256
In Stock
1 : kr.4.22000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
15.864
In Stock
1 : kr.4.42000
Tray
-
Tray
Active
Board Level
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.181" (30.00mm)
-
0.472" (12.00mm)
-
-
10.00°C/W
Aluminum
Black Anodized
573300D00010(G)
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
76.304
In Stock
1 : kr.4.48000
Cut Tape (CT)
250 : kr.3.33800
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
96.153
In Stock
1 : kr.4.99000
Cut Tape (CT)
400 : kr.3.62575
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
577002B00000G
HEAT SINK TO-220 .250" COMPACT
Boyd Laconia, LLC
9.418
In Stock
1 : kr.4.99000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.250" (6.35mm)
1.5W @ 50°C
10.00°C/W @ 500 LFM
32.00°C/W
Aluminum
Black Anodized
20188
SILENTSTEPSTICK HEATSINK 9 X 9 X
Watterott Electronic GmbH
4.065
In Stock
1 : kr.5.95000
Bulk
-
Bulk
Active
Top Mount
Stepper Motor Driver Board
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.354" (9.00mm)
0.354" (9.00mm)
-
0.472" (12.00mm)
-
-
-
Aluminum
Black Anodized
576802B04000G
HEAT SINK VERT PLUG-IN TO-220
Boyd Laconia, LLC
2.014
In Stock
1 : kr.6.02000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220, TO-262
Clip and PC Pin
Rectangular, Fins
0.750" (19.05mm)
0.500" (12.70mm)
-
0.500" (12.70mm)
1.0W @ 30°C
7.00°C/W @ 400 LFM
27.30°C/W
Aluminum
Black Anodized
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
11.124
In Stock
1 : kr.6.34000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
4.605
In Stock
1 : kr.6.40000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
17.830
In Stock
1 : kr.6.72000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
Same Sky (Formerly CUI Devices)
1.299
In Stock
1 : kr.7.36000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
375424B00034G
HEATSINK PIN-FIN W/TAPE
Boyd Laconia, LLC
12.655
In Stock
1 : kr.8.58000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.598" (15.19mm)
0.598" (15.19mm)
-
0.252" (6.40mm)
-
17.60°C/W @ 200 LFM
62.50°C/W
Aluminum
Black Anodized
XL25W-12-12-12
CERAMIC HEAT SINK 12X12X10MM WHI
t-Global Technology
4.889
In Stock
1 : kr.8.77000
Bulk
Bulk
Active
Heat Spreader
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape
Square
0.472" (12.00mm)
0.472" (12.00mm)
-
0.394" (10.00mm)
-
-
-
Ceramic
-
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
978
In Stock
1 : kr.9.60000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
LTN20069-T5
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield Thermal Solutions
7.690
In Stock
1 : kr.9.98000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
Showing
of 123.755

Heat Sinks


Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.