Settings
Fast Delivery
Free Shipping
Incoterms
Payment Types
Marketplace Product
Slide 1
Slide 2
Slide 3
Slide 4
Slide 5
Slide 6
Slide 7
Slide 8
Slide 9
Slide 10
Slide 11
Slide 12
Slide 13
Slide 14
Slide 15
Slide 16
Slide 17
Product List
The ISL8203M utilizes a new QFN module packaging technology which provides a simple design approach similar to the QFN packages used for ICs with only the ground pad left floating in the middle of the package. This allows easy soldering and inspection for all of the pins on the PCB board. With dimensions of 9mm x 6.5mm x 1.85mm, this enables an extremely small power supply to be designed.
PTM Published on: 2015-10-22
Denmark