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Cinch Connectivity Solutions CIN:APSE Solderless, High Density, Custom Interconnects

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications for Military, Aerospace, Datacom, Satellite and Test Equipment.

12/28/2020 2:12:58 PM

Part List

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
CONN SPRING MOD 25POS SMD3800520001CONN SPRING MOD 25POS SMD41 - Immediate$631.43View Details
CONN SPRING MOD 51POS SMD3800520013CONN SPRING MOD 51POS SMD0 - Immediate$556.12View Details
CABLE FFC/FPC 25POS 0.64MM 3"4631533093CABLE FFC/FPC 25POS 0.64MM 3"6 - Immediate$547.64View Details

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CIN::APSE Stacking Connector Jumpers Cinch Connectivity’s CIN:APSE stacking connectors are designed for coplanar and angled board-to-board applications.

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