Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

WS991SNL500T4

DigiKey Part Number
315-WS991SNL500T4-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
WS991SNL500T4
Description
SOLDER PASTE THERMALLY STABLE WS
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Flux Type
Water Soluble
Manufacturer
Chip Quik Inc.
Mesh Type
4
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 17.64 oz (500g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Base Product Number
Melting Point
423°F (217°C)
Report Product Information Error
Documents & Media
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 56
Check for Additional Incoming Stock
Quantity
All prices are in DKK
Bulk
QuantityUnit PriceExt Price
1kr.694.17000kr.694.17
Manufacturers Standard Package
Unit Price without VAT:kr.694.17000
Unit Price with VAT:kr.867.71250
You May Also Be Interested InSee All
2 Items
TS991SNL500T4

TS991SNL500T4

SOLDER PASTE THERMALLY STABLE NC

Chip Quik Inc.

kr.693.22000
TS391SNL250

TS391SNL250

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

kr.443.48000
Terms & Conditions Privacy Notice Cookie Settings
Copyright © 1995-2026, DigiKey. All Rights Reserved.
ECIA Member
This site is protected by VikingCloud's Trusted Commerce program
ECIA Member