SMD to DIP PowerSOIC, PSOP, HSOP 8 0.050" (1.27mm) FR4 Epoxy Glass
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SMD to DIP PowerSOIC, PSOP, HSOP 8 0.050" (1.27mm) FR4 Epoxy Glass

IPC0051

DigiKey Part Number
IPC0051-ND
Manufacturer
Manufacturer Product Number
IPC0051
Description
POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP PowerSOIC, PSOP, HSOP 8 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Package Accepted
PowerSOIC, PSOP, HSOP
Manufacturer
Chip Quik Inc.
Number of Positions
8
Series
Pitch
0.050" (1.27mm)
Packaging
Bulk
Board Thickness
0.062" (1.57mm) 1/16"
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
1.000" x 0.600" (25.40mm x 15.24mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 137
Check for Additional Incoming Stock
All prices are in DKK
Bulk
QuantityUnit PriceExt Price
1kr.33.54000kr.33.54
Manufacturers Standard Package
Unit Price without VAT:kr.33.54000
Unit Price with VAT:kr.41.92500