X7R with KONNEKT™ Datasheet

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1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Built Into Tomorrow
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC
(Commercial & Automotive Grade)
Overview
KEMET's X7R with KONNEKT™ technology surface mount
capacitors are designed for applications where higher
capacitance and voltage are needed without requiring
additional board space. KONNEKT high density packaging
technology uses an innovative Transient Liquid Phase
Sintering (TLPS) material to create a surface mount multi-
chip solution for high density packaging.
KEMET’s X7R dielectric features a 125°C maximum
operating temperature and is considered temperature
stable. The Electronics Components, Assemblies
and Materials Association (EIA) characterizes X7R
dielectric as a Class II material. Components of this
classification are fixed, ceramic dielectric capacitors
suited for bypass and decoupling applications or for
frequencydiscriminating circuits where Q and stability of
capacitance characteristics are not critical. X7R exhibits
a predictable change in capacitance with respect to time
and voltage, boasting a minimal change in capacitance
with reference to ambient temperature.
Capacitance change is limited to ±15% from −55°C to
+125°C.
In addition to their use in power supplies, these capacitors
can be used in industries related to automotive (hybrid),
telecommunications, medical, military, aerospace,
semiconductors and test/diagnostic equipment.
Automotive Grade devices are also available which meet
the demanding Automotive Electronics Council's AEC-Q200
qualification requirements
For added reliability, KEMET's flexible termination
technology is an available option that provides superior
flex performance over standard termination systems. This
technology was developed to address flex cracks, which are
the primary failure mode of MLCCs and typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
body of the MLCC, therefore mitigating flex cracks which
can result in low IR or short circuit failures.
Benefits
• Commercial and Automotive Grade (AEC-Q200)
• Industry-leading CV values
• Capacitance offerings ranging from 2.4 nF – 20 µF
• DC voltage ratings from 25 – 3,000 V
• EIA 1812 and 2220 case sizes
• Operating temperature range of −55°C to +125°C
• Low ESR and ESL
• Non-polar device, minimizing installation concerns
• Lead (Pb)-free, RoHS, and REACH compliant
• Surface mountable using standard MLCC reflow profiles
• Flexible termination option available.
Applications
• SMPS (Switch Mode Power Supplies)
• Lighting ballasts, HID lighting
• DC/DC Converters
• Telecom equipment
• Industrial and medical equipment
• Filters
• Snubbers
• DC Blocking
• Bypass
Lead-free
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2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Ordering Information
C1812 C944 K C R L C XXXX
Ceramic Case Size
(L"x W ")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage (V) Dielectric Subclass
Designation
Termination
Finish
Orientation and
Packaging
(Suffix/C-Spec)
C1812
2220
C = Standard
X = Flexible
Termination
Two single
digits +
number of
zeros.
K = ±10%
M = ±20%
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
C = 500 V
B = 630 V
D = 1,000 V
F = 1,500 V
G = 2,000 V
Z = 2,500 V
H = 3,000 V
R =
X7R
L =
KONNEKT
C =
100% matte Sn
See
"Packaging and
Orientation
C-Spec
Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type Mounting Orientation1Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
7" Reel/Unmarked TU
13" Reel/Unmarked 7210
Automotive Grade
7" Reel/Unmarked AUTO
13" Reel/Unmarked AUTO7210
1 All parts are shipped in standard orientation which refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets.
KEIl/IEI' u new company
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notification (PCN)
The KEMET product change notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notification Due To: Days Prior To
Implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specification requirements are properly
understood and fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part number specific PPAP available
○ Product family PPAP only
KEVIIECIEI'
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
Standard Mounting
2 Chips
L
B
W
T
Number
of Chips
EIA
SIZE
CODE
METRIC
SIZE
CODE
TERMINATION L
LENGTH
W
WIDTH
T
THICKNESS
B
BANDWIDTH
Mounting
Technique
21812 4532
Standard 4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012) See Table 1A
for Thickness
0.60 (0.024)
±0.35 (0.014) Solder Reflow
Only
Flexible 4.50 (0.178)
±0.40 (0.016)
3.20 (0.126)
±0.30 (0.012)
0.70 (0.028)
±0.35 (0.014)
22220 5750
Standard 5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016 See Table 1B
for Thickness
0.60 (0.024)
±0.35 (0.014 Solder Reflow
Only
Flexible 5.90 (0.232)
±0.75 (0.030)
5.00 (0.197)
±0.40 (0.016)
0.70 (0.028)
±0.35 (0.014)
KEIl/IEI' u new company
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Table 1A - 1812 Product Ordering Codes, Ratings, and Package Quantities
KEMET Part
Number1Capacitance Cap
Code Voltage
Number
of
Chips
Thickness
mm (inch)
Typical
Average
Piece
Weight
(g)
Tape & Reel Quantity
7" Tape &
Reel
13" Tape &
Reel
C1812(a)206(b)3RLC(c) 20 µF 206 25 V
2
3.30 (0.130)
±0.40 (0.16) 0.25 500 2,000
C1812(a)945(b)5RLC(c) 9.4 µF 945 50 V 3.30 (0.130)
±0.40 (0.16) 0.25 500 2,000
C1812(a)665(b)1RLC(c) 6.6 µF 665 100 V 3.90 (0.153)
±0.40 (0.16) 0.28 275 1,050
C1812(a)944(b)2RLC(c) 0.94 µF 944 200 V 3.50 (0.138)
±0.30 (0.12) 0.25 500 2,000
C1812(a)944(b)ARLC(c) 0.94 µF 944 250 V 3.50 (0.138)
±0.30 (0.12) 0.25 500 2,000
C1812(a)664(b)CRLC(c) 0.66 µF 664 500 V 4.30 (0.169)
±0.20 (0.008) 0.30 250 1,000
C1812(a)304(b)BRLC(c) 0.3 µF 304 630 V 3.50 (0.138)
±0.40 (0.16) 0.25 500 2,000
C1812(a)204(b)DRLC(c) 0.2 µF 204 1,000 V 3.50 (0.138)
±0.30 (0.12) 0.25 500 2,000
C1812(a)663(b)FRLC(c) 0.066 µF 663 1,500 V 5.10 (0.201)
±0.40 (0.16) 0.35 200 900
C1812(a)203(b)GRLC(c) 0.044 µF 203 2,000 V 5.10 (0.201)
±0.40 (0.016) 0.35 200 900
C1812(a)942(b)ZRLC(c) 0.0094 µF 942 2,500 V 5.10 (0.201)
±0.40 (0.016) 0.35 200 900
C1812(a)242(b)HRLC(c) 0.0024 µF 242 3,000 V 3.50 (0.138)
±0.30 (0.12) 0.35 500 2,000
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C" or "X".
(b) Capacitance tolerance character "K" or "M."
(c) Product Grade: "TU" for Commercial or "AUTO" for Automotive
KEIl/IEI' u new company 4.90 (0 193) 3.1 (0.122) 3.1 (0.122) 3.1 (0.122) 1 (0.200) 1 (0.200) 1 (0.200) 1 (0.200) 1 (0.200) 1 (0.200) 1 (0.200) :040 (0.016)
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Table 1B - 2220 Product Ordering Codes, Ratings, and Package Quantities
KEMET Part
Number1Capacitance Cap
Code Voltage
Number
of
Chips
Thickness
mm (inch)
Typical
Average
Piece
Weight
(g)
Tape & Reel Quantity
7" Tape &
Reel
13" Tape &
Reel
C2220(a)206(b)5RLC(c) 20 µF 206 50 V
2
4.90 (0.193)
±0.30 (0.11) 0.78 225 900
C2220(a)205(b)1RLC(c) 2 µF 205 100 V
3.1 (0.122)
±0.30 (0.11)
0.47 500 1,925
C2220(a)205(b)2RLC(c) 2 µF 205 200 V
3.1 (0.122)
±0.30 (0.11) 0.47 500 1,925
C2220(a)205(b)ARLC(c) 2 µF 205 250 V
3.1 (0.122)
±0.30 (0.11)
0.47 500 1,925
C2220(a)944(b)CRLC(c) 0.94 µF 944 500 V
5.1 (0.200)
±0.40 (0.016) 0.81 300 1,250
C2220(a)664(b)BRLC(c) 0.66 µF 664 630 V
5.1 (0.200)
±0.40 (0.016)
0.80 300 1,250
C2220(a)244(b)DRLC(c) 0.24 µF 244 1,000 V
5.1 (0.200)
±0.40 (0.016) 0.80 300 1,250
C2220(a)164(b)FRLC(c) 0.16 µF 164 1,500 V
5.1 (0.200)
±0.40 (0.016)
0.79 300 1,250
C2220(a)443(b)GRLC(c) 0.044 µF 443 2,000 V
5.1 (0.200)
±0.40 (0.016) 0.80 300 1,250
C2220(a)303(b)ZRLC(c) 0.030 µF 303 2,500 V
5.1 (0.200)
±0.40 (0.016)
0.80 300 1,250
C2220(a)303(b)HRLC(c) 0.030 µF 303 3,000 V
5.1 (0.200)
±0.40 (0.016)
0.80 300 1,250
1 Complete part number requires additional characters in the numbered positions provided in order to indicate capacitance tolerance and grade.
For each numbered position, available options are as follows:
(a) End Termination "C" or "X".
(b) Capacitance tolerance character "K" or "M."
(c) Product Grade: "TU" for Commercial or "AUTO" for Automotive
KEIl/IEI' u new company Visual and Mechanical KEMET \ntema\
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only)
Test Reference Test Condition Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet
Capacitance
(Cap)
KEMET
Internal
C ≤ 10 µF 1 kHz ±50 Hz and 1.0 ±0.2 Vrms
C > 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms
Capacitance measurements (including tolerance)
are indexed to a referee time of 1,000 hours
Within Tolerance
Dissipation
Factor (DF)
KEMET
Internal
C ≤ 10 µF
Frequency: 1 kHz ±50 Hz
Voltage: 1.0 ±0.2 Vrms,0.5 ±0.2 Vrms
C > 10 µF
Frequency: 120 Hz ±10 Hz
Voltage: 0.5 ±0.1 Vrms
Within Specification
EIA Case
Size
Rated DC
Voltage Capacitance Dissipation Factor
(Maximum %)
1812 ALL
< 20 µF 2.5
20 µF 3.5
2220 ALL 2.5
Insulation
Resistance (IR)
KEMET
Internal Apply rated voltage for 120 seconds at 25°C
Within Specification
To obtain IR limit, divide MΩ-µF value by the capacitance and
compare to GΩ limit. Select the lower of the two limits.
EIA
Case
Size
Rated
DC Voltage IR Limit
1812
25 – 100 V 500 megaohm microfarads or 10 GΩ
200 – 250 V 1,000 megaohm microfarads or 100 GΩ
500 – 1,000 V 100 megaohm microfarads or 10 GΩ
1,500 – 3,000 V 1,000 megaohm microfarads or 100 GΩ
2220
50 – 100 V 500 megaohm microfarads or 10 GΩ
200 – 250 V 1,000 megaohm microfarads or 100 GΩ
500 – 630 V 100 megaohm microfarads or 10 GΩ
1,000 – 3,000 V 1,000 megaohm microfarads or 100 GΩ
Temperature
Coefficient of
Capacitance
(TCC)
KEMET
Internal
C ≤ 10µF
Frequency: 1 kHz ±50 Hz
Voltage*: 1.0 ±0.2 Vrms
C > 10µF
Frequency: 120 Hz ±10 Hz
Voltage: 0.5 ±0.1 Vrms
* See part number specification sheet for voltage
Step Temperature (°C)
1+25°C
2−55°C
3+25°C (Reference)
4+125°C
Capacitance ±15% over
−55°C to +125°C
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8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test Reference Test Condition Limits
Dielectric
Withstanding
Voltage
(DWV)
KEMET
Internal
Rated
DC Voltage
DWV Voltage
(% of Rated)
< 500 250%
500/630 150%
≥ 1,000 120%
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without
insulation breakdown or damage.
Aging Rate
(Maximum %
Capacitance
Loss/Decade Hour)
KEMET
Internal
Capacitance measurements (including tolerance) are indexed to a
referee time of 1,000 hours.
Please refer to a part number specific datasheet for referee time
details.
3% Loss/Decade Hour
Terminal
Strength
KEMET
Internal
Shear stress test per specific case size, Time: 60±1 seconds
No evidence of mechanical
damage
Case
Size Force
1812 18N
2220
Board
Flex AEC-Q200-005
Standard Termination System 2.0 mm
Flexible Termination System 3.0 mm
Test time: 60± 5 seconds
Ramp time: 1 mm/second
No evidence of mechanical
damage
Solderability KEMET
Custom Test
1. Board shear – SAC305 solder. Shear force of 1.8 kg (minimum)
2. Wetting balance – IEC 60068–2–69
Visual Inspection.
95% coverage on termination.
No leaching
Temperature
Cycling
JESD22
Method JA-104
1,000 cycles (−55°C to +125°C)
2 – 3 cycles per hour
Soak Time 1 or 5 minutes
Measurement at 24 hours ±4
hours after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
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9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test Reference Test Condition Limits
Biased
Humidity
MIL-STD-202
Method 103
Load Humidity:
1,000 hours 85°C/85% RH and 200 VDC maximum.
Low Volt Humidity:
1,000 hours 85°C/85% RH and 1.5 V.
Measurement at 24 hours ±4 hours after
test conclusion.
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
DF Limits
Maximum (%)
Initial Post
2.5 3.0
3.5 5.0
Moisture
Resistance
MIL-STD-202
Method 106
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required.
Measurement at 24 hours ±4 hours after
test conclusion.
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
DF Limits
Maximum (%)
Initial Post
2.5 3.0
3.5 5.0
Thermal Shock MIL-STD-202
Method 107
Number of cycles required 5, (−55°C to 125°C)
Dwell time 15 minutes.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
High
Temperature
Life
MIL-STD-202
Method 108
1,000 hours at 125°C with 1.0 X rated voltage applied
Within Post Environmental Limits
Cap: ±20% shift
IR: 10% of Initial Limit
DF Limits
Maximum (%)
Initial Post
2.5 3.0
3.5 5.0
Storage Life 1,000 hours at 125°C, Unpowered
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10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Performance and Reliability: Test Methods and Conditions (Commercial Only) cont.
Test Reference Test Condition Limits
Vibration MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5 ms Half-sine,
Velocity Change 15.4 feet/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents.
Visual Inspection 10X
Readable marking,
no decoloration or stains.
No physical damage.
Environmental Compliance
Lead-free
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Land Pattern Design Recommendations per IPC-7351 (mm)
Chip
Number Mounting EIA SIZE
CODE
METRIC
SIZE CODE
END
TERMINATION
Median (Nominal) Land
Protrusion
C Y X V1 V2
2Standard 1812 4532 Standard 2.05 1.40 3.50 6.00 4.00
Flexible 2.00 1.60 3.50 6.10 4.00
2Standard 2220 5750
2.65
1.50
5.40
7.30
5.90
Flexible 2.75 1.90 5.40 7.90 5.90
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11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Reflow Soldering Profile
KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with
convection and IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020
standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these
conditions.
Profile Feature Termination Finish
100% matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
150°C
Temperature Maximum (T
Smax
)200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second maximum
Liquidous Temperature (TL)217°C
Time Above Liquidous (tL) 60 – 150 seconds
Peak Temperature (TP)260°C
Time Within 5°C of Maximum Peak
Temperature (tP)30 seconds maximum
Ramp-Down Rate (TP to TL)6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Hand Soldering and Removal of KONNEKT Capacitors
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reflow where temperature, time
and air flow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In
these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may
lead to cracking in the ceramic or separation of the TLPS material.
Please see KEMET's KONNEKT Soldering Guidelines here.
KEll/IEI'
12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Dielectric Material
(BaTiO3)
Termination Finish
(100% matte Sn)
Termination Finish
(100% matte Sn)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Bonding Material
(See Image Below)
KEll/IEI' «magnum Detailed Cross Section Dieleclflc Malevial (Ill'l'iOJ
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Construction – Flexible Termination
Bonding Material
MLCC
MLCC
CuSn TLPS
KEIVIEI' uV‘fiEO company Embossed mam camev 15 mm camenape mo mm (7.00“) 535mm >50mm&553mm
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers X7R with KONNEKT technology capacitors packaged in 16 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems.
16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed
plastic carrier
Embossment
cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
KONNEKT
Standard
orientation
in pocket
KEMET
®
Bar code label
Sprocket
holes
Table 4 – Carrier Tape Configuration, Embossed Plastic (mm)
EIA Case Size Number of
Chips Chip Thickness Tape Size
(W)1
Embossed Plastic
7" Reel 13" Reel
Pitch (P
1
)2
KONNEKT 1812 2
≤ 3.5 mm
16
8 8
> 3.5 mm 12 12
KONNEKT 2220 2
≤ 3.5 mm
>5.0 mm & ≤ 5.3 mm
16
8 8
> 3.5 mm ≤ 5.0 12 12
1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
2. Refer to Tables 4 and 5 for tolerance specifications.
KEIVIEI' u vao company Cavzr Yin: “w 0mm 0! Unluling me Tnple 7.9 12.020.10 Double 7.5 8.010 W0 (8mm) (0.295) (0315:0004) Tnple 8 5 12.020.10 (12mm) (0.335) Double 9.2 (8mm) (0.363) (0.472+a.004) 5.01010 (031510.004)
15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape
Size D0
D1 Minimum
Note 1 E1P0P2
R Reference
Note 2
S1 Minimum
Note 3
T
Maximum
T1
Maximum
16 mm 1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.5
(0.059)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Case
Size
Number
of Chips
Tape
Size Pitch B1 Maximum
Note 4
E2
Minimum F P1
T2
Maximum
W
Maximum A0,B0 & K0
1812 216 mm
Triple
(12mm)
7.9
(0.311)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.472±0.004)
6.5
(0.256)
16.3
(0.642) Note 5
Double
(8mm)
7.5
(0.295)
8.0±0.10
(0.315±0.004)
2220 216 mm
Triple
(12mm)
8.5
(0.335)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.472±0.004)
6.5
(0.256)
16.3
(0.642) Note 5
Double
(8mm)
9.2
(0.363)
8.0±0.10
(0.315±0.004)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied. See EIA Document 481, Paragraph 4.3 (b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4).
(e) For KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
KEIVIEI'
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
KEIVIEI' u new company 178:0 20 (13.00010 008) 50 (1.969) 15.4 +2.0/70.0 (0.646 +0 070/70 0) 22.4 (0 882) Shall accommodate tape width without mlerference
17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
16 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0 +0.5/−0.2
(0.521 +0.02/−0.008)
20.2
(0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum
See Note 2, Tables 2-3 W1 W2 Maximum W3
16 mm
50
(1.969)
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
Shall accommodate tape
width without interference
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18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 7 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
KEIVIEI' «WEED-mm
19© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1108_KONNEKT_X7R • 8/25/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R with KONNEKT™ Technology, 25 – 3,000 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.