FO-CAP, X7R Dielectric 16-200 VDC Datasheet by KEMET

Datasheet Feedback/Errors

E‘ectromc Components KEII/IEI' CHARGED?

One world. One KEMET

Overview

KEMET’s Ceramic Open Mode capacitor in X7R dielectric

is designed to significantly minimize the probability of a

low IR or short circuit condition when forced to failure in

a board stress flex situation, thus reducing the potential

for catastrophic failure. The Open Mode capacitor may

experience a drop in capacitance; however, a short is

unlikely because a crack will not typically propagate

across counter electrodes within the device’s “active area.”

Since there will not be any current leakage associated

with a typical Open Mode flex crack, there is no localized

heating and therefore little chance for a catastrophic and

potentially costly failure event.

Driven by the demand for a more robust and reliable

component, the Open Mode capacitor was designed for

critical applications where higher operating temperatures

and mechanical stress are a concern. These capacitors

are widely used in automotive circuits as well as power

supplies (input and output filters) and general electronic

applications.

Concerned with flex cracks resulting from excessive

tensile and shear stresses produced during board flexure

and thermal cycling? These devices are available with

KEMET's Flexible termination technology which inhibits the

transfer of board stress to the rigid ceramic body, therefore

mitigating flex cracks which can result in low IR or short

circuit failures. Although flexible termination technology

does not eliminate the potential for mechanical damage that

may propagate during extreme environmental and handling

conditions, it does provide superior flex performance over

standard termination systems. When combined with flexible

termination technology these devices offer the ultimate level

of protection against a low IR or short circuit condition. Open

Mode devices compliment KEMET's Floating Electrode

(FE-CAP) and Floating Electrode with Flexible Termination

(FF-CAP) product lines by providing a fail-safe design

optimized for mid to high range capacitance values. These

devices exhibit a predictable change in capacitance with

respect to time and voltage and boast a minimal change

in capacitance with reference to ambient temperature.

Capacitance change is limited to ±15% from −55°C to +125°C.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric,

16 – 200 VDC (Commercial & Automotive Grade)

Ordering Information

C1210 J685 K 3 R A C TU

Ceramic Case Size

(L" x W")

Specification/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated

Voltage

(VDC)

Dielectric

Failure

Rate/

Design

Termination Finish1

Packaging/Grade

(C-Spec)

0805

1206

1210

1812

F = Open Mode

J = Open Mode

with Flexible

Termination

Two significant

digits + number

of zeros

K = ±10%

M = ±20%

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

R = X7R A = N/A C = 100% Matte Sn

L = SnPb

(5% Pb minimum)

See "Packaging

C-Spec

Ordering

Options Table"

below

1 Additional termination finish options may be available. Contact KEMET for details.

1 SnPb termination finish option is not available on automotive grade product.

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Elecrmmc Compancnls KEIl/IEI' EHARGED! 7411 (HA 0603 and smaller case sizes) 7210 (EIA 0305 and larger case sizes) 7040 EIA 0603 and smaller case sizes) 7215 EIA 0805 and larger case sizes) AUT07411 QEIA 0603 and smaller case sizes) AUT07210 EIA 0805 and larger case sizes)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging Type Packaging/Grade

Ordering Code (C-Spec)

Commercial Grade1

Bulk Bag

Not Required (Blank)

7" Reel/Unmarked

13" Reel/Unmarked

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

7" Reel/Marked

13" Reel/Marked

7040 (EIA 0603 and smaller case sizes)

7215 (EIA 0805 and larger case sizes)

7" Reel/Unmarked/2 mm pitch

7081

13" Reel/Unmarked/2 mm pitch

7082

Automotive Grade3

7" Reel

AUTO

13" Reel/Unmarked

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

7" Reel/Unmarked/2 mm pitch

3190

13" Reel/Unmarked/2 mm pitch

3191

1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked.

2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel

Packaging Quantities" and "Tape & Reel Packaging Information".

3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".

3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For

more information see "Capacitor Marking".

Benefits

• −55°C to +125°C operating temperature range

• Open Mode/fail open design

• Mid to high capacitance flex mitigation

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0805, 1206, 1210, and 1812 case sizes

• DC voltage ratings of 16 V, 25 V, 50 V, 100 V, and 200 V

• Capacitance offerings ranging from 1,000 pF to 6.8 μF

• Available capacitance tolerances of ±5%, ±10%, and ±20%

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

• Commercial and Automotive (AEC–Q200) grades available

• SnPb termination finish option available upon request

(5% Pb minimum)

• Flexible termination option available upon request

Applications

Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot

be fused to open when short circuits occur due to flex cracks. Markets include automotive applications that are directly

connected to the battery and/or involve conversion to a 42 V system and raw power input side filtering in power conversion.

ammmc compmm KEIVIEI' crummy:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive

Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below).

Product Change Notifi cation (PCN)

The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fi t, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

KEMET Automotive

C-Spec

Customer Notifi cation due to: Days prior to

implementation

Process/Product change Obsolescence*

KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum

AUTO Yes (without approval) Yes 90 days minimum

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and specifi cation requirements are properly

understood and fulfi lled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive

C-Spec

PPAP (Product Part Approval Process) Level

12345

KEMET assigned1●●●●●

AUTO ○ ○

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.

● Part number specifi c PPAP available

○ Product family PPAP only

ammm Compancnls KEIVIEI' Emma): 2 00 (0.079) 1.25 (0.049) 0.50 (0.02) 20 20 (0.005) 20.20 (0 003) 20.25 (0 010) 3.20(0120) 100 ((1.063) 0.50 (0.02) 20 20 (0.005) 20.20 (0 003) 20.25 (0 010) 3.20(0120) 2.50 (0.090) 0.50 (0.02) 20 20 (0.005) 20.20 (0 003) 20.25 (0 010) 4.50 (0.177) 3.20 (0.120) 0 00 (0 024) 20.30 (0.012) 20.30 (0.012) 20.35 (0 014) 2 00 (0.079) 1.25 (0.049) 0.50 (0.02) 20.30 (0.012) 20.30 (0.012) 20.25 (0 010) 330(0130) 100 ((1.063) 0 00 (0 024) 20.40 (0 010) 20.35 (0.013) 20.25 (0 010) 3.30 (0 130) 2.50 (0.102) 0 00 (0 024) 20.40 (0 010) 20.30 (0.012) 20.25 (0 010) 4.50 (0 170) 3.20 (0.120) 0 70 (0.023) 20.40 (0 010) 20.30 (0.012) 20.35 (0 014)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches) – Standard Termination

EIA Size

Code

Metric Size

Code

Length

Width

Thickness

Bandwidth

Separation

Minimum

Mounting

Technique

0805 2012

2.00 (0.079)

±0.20 (0.008)

1.25 (0.049)

±0.20 (0.008)

See Table 2 for

Thickness

0.50 (0.02)

±0.25 (0.010)

0.75 (0.030) Solder Wave or

Solder Reflow

1206 3216

3.20 (0.126)

±0.20 (0.008)

1.60 (0.063)

±0.20 (0.008)

0.50 (0.02)

±0.25 (0.010)

N/A

1210 3225

3.20 (0.126)

±0.20 (0.008)

2.50 (0.098)

±0.20 (0.008)

0.50 (0.02)

±0.25 (0.010)

Solder Reflow

Only

1812 4532

4.50 (0.177)

±0.30 (0.012)

3.20 (0.126)

±0.30 (0.012)

0.60 (0.024)

±0.35 (0.014)

Dimensions – Millimeters (Inches) – Flexible Termination

EIA Size

Code

Metric Size

Code

Length

Width

Thickness

Bandwidth

Separation

Minimum

Mounting

Technique

0805 2012

2.00 (0.079)

±0.30 (0.012)

1.25 (0.049)

±0.30 (0.012)

See Table 2 for

Thickness

0.50 (0.02)

±0.25 (0.010)

0.75 (0.030) Solder Wave or

Solder Reflow

1206 3216

3.30 (0.130)

±0.40 (0.016)

1.60 (0.063)

±0.35 (0.013)

0.60 (0.024)

±0.25 (0.010)

N/A

1210 3225

3.30 (0.130)

±0.40 (0.016)

2.60 (0.102)

±0.30 (0.012)

0.60 (0.024)

±0.25 (0.010)

Solder Reflow

Only

1812 4532

4.50 (0.178)

±0.40 (0.016)

3.20 (0.126)

±0.30 (0.012)

0.70 (0.028)

±0.35 (0.014)

Qualification/Certification

Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are

referenced in Table 4, Performance and Reliability.

Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

ammmc compmm KEIVIEI' crummy: 250% of rated Volta e (531 secands and c arge/discharge nm exceedmg SOmA)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range −55°C to +125°C

Capacitance Change with Reference to

+25°C and 0 Vdc Applied (TCC) ±15%

1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%

2Dielectric Withstanding Voltage (DWV)

250% of rated voltage

(5±1 seconds and charge/discharge not exceeding 50mA)

3Dissipation Factor (DF) Maximum Limit at 25°C 5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)

4Insulation Resistance (IR) Minimum Limit at 25°C See Insulation Resistance Limit Table

(Rated voltage applied for 120±5 seconds at 25°C)

1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

3 Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

X7R

> 25

All

3.0

±20% 10% of Initial

Limit

16/25 5.0

< 16 7.5

ammm Compancnls KEIl/IEI' CHARGED! 1,000 Megohm Micratarads or 100 ca 500 Megohm Microfarads or 10 an

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Insulation Resistance Limit Table (X7R Dielectric)

EIA Case Size

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

0201 N/A ALL

0402 < 0.012 µF ≥ 0.012 µF

0603 < 0.047 µF ≥ 0.047 µF

0805 < 0.15 µF ≥ 0.15 µF

1206 < 0.47 µF ≥ 0.47 µF

1210 < 0.39 µF ≥ 0.39 µF

1808 ALL N/A

1812 < 2.2 µF ≥ 2.2 µF

1825 ALL N/A

2220 < 10 µF ≥ 10 µF

2225 ALL N/A

Eissimms Compuncnts KEIVIEI' crummy: Capacitance mum Availability and Chip Thickness Codes rnimm m Table 1 lav Chip thickness Dimensions

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall - Standard Termination (0805 – 1812 Case Sizes)

Capacitance Capacitance

Code

Case Size/

Series C0805F/J C1206F/J C1210F/J C1812F/J

Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2

Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,000 pF 102 K M DP DP DP DP DP

1,200 pF 122 K M DP DP DP DP DP

1,500 pF 152 K M DP DP DP DP DP

1,800 pF 182 K M DP DP DP DP DP

2,200 pF 222 K M DP DP DP DP DP

2,700 pF 272 K M DP DP DP DP DP

3,300 pF 332 K M DP DP DP DP DP

3,900 pF 392 K M DP DP DP DP DP

4,700 pF 472 K M DP DP DP DP DP

5,600 pF 562 K M DP DP DP DP DP

6,800 pF 682 K M DP DP DP DP DP

8,200 pF 822 K M DP DP DP DP DP

10,000 pF 103 K M DP DP DP DP DP

12,000 pF 123 K M DP DP DP DP DG

15,000 pF 153 K M DP DP DP DP DG

18,000 pF 183 K M DP DP DP DP ER ER ER ER ER

22,000 pF 223 K M DP DP DP DG ER ER ER ER ER

27,000 pF 273 K M DP DP DP DG ER ER ER ER ER

33,000 pF 333 K M DP DP DP DG ER ER ER ER ER

39,000 pF 393 K M DP DP DP DG ER ER ER ER ER

47,000 pF 473 K M DP DP DP DS ER ER ER ER EU GB GB GB GB

56,000 pF 563 K M DP DP DP ER ER ER ER EU GB GB GB GB

68,000 pF 683 K M DP DP DG DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB

82,000 pF 823 K M DP DP DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB

0.10 µF 104 K M DG DG DG ER ER ER ER EU FX FX FX FX FZ GB GB GB GB

0.12 µF 124 K M DG DG ER ER ER ER FX FX FX FX FZ GB GB GB GB

0.15 µF 154 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB

0.18 µF 184 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB

0.22 µF 224 K M DG DP DG ER ER ER ES FX FX FX FZ FS GB GB GB GC

0.27 µF 274 K M DP DP ER ER ER FX FX FX FZ GB GB GB GF

0.33 µF 334 K M DP DG EU EU EU EU FX FX FX FU GB GB GB GK

0.39 µF 394 K M DP DG EU EU FX FX FZ FU GB GB GB GL

0.47 µF 474 K M DS DG EU EU ER FX FX FZ FJ GB GB GC

0.56 µF 564 K M EU FX FX FZ FR GB GB GD

0.68 µF 684 K M DG EU FX FZ FU FR GD GD GF

0.82 µF 824 K M EU FX FZ FU FR GD GD GK

1.0 µF 105 K M EU ER EH FX FU FJ FS GN GN GM

1.2 µF 125 K M FZ

1.5 µF 155 K M FU

1.8 µF 185 K M FU

2.2 µF 225 K M ER EH FJ FM FM

2.7 µF 275 K M

3.3 µF 335 K M FM

3.9 µF 395 K M

4.7 µF 475 K M EH FZ FM GK GK

6.8 µF 685 K M FS FS

Capacitance Capacitance

Code

Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200

Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2

Case Size/ Series C0805F/J C1206F/J C1210F/J C1812F/J

Eissimms Compuncnts KEIVIEI' crummy: Capacitance mum Availability and Chip Thickness Codes rnimm m Table 1 lav Chip thickness Dimensions

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 1B – Capacitance Range/Selection Waterfall - Flexible Termination (0805 – 1812 Case Sizes)

Capacitance Capacitance

Code

Case Size/

Series C0805F/J C1206F/J C1210F/J C1812F/J

Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2

Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

1,000 pF 102 K M DD DD DD DD DD

1,200 pF 122 K M DD DD DD DD DD

1,500 pF 152 K M DD DD DD DD DD

1,800 pF 182 K M DD DD DD DD DD

2,200 pF 222 K M DD DD DD DD DD

2,700 pF 272 K M DD DD DD DD DD

3,300 pF 332 K M DD DD DD DD DD

3,900 pF 392 K M DD DD DD DD DD

4,700 pF 472 K M DD DD DD DD DD

5,600 pF 562 K M DD DD DD DD DD

6,800 pF 682 K M DD DD DD DD DD

8,200 pF 822 K M DD DD DD DD DD

10,000 pF 103 K M DD DD DD DD DD

12,000 pF 123 K M DD DD DD DD DG

15,000 pF 153 K M DD DD DD DD DG

18,000 pF 183 K M DD DD DD DD ER ER ER ER ER

22,000 pF 223 K M DD DD DD DG ER ER ER ER ER

27,000 pF 273 K M DD DD DD DG ER ER ER ER ER

33,000 pF 333 K M DD DD DD DG ER ER ER ER ER

39,000 pF 393 K M DD DD DD DG ER ER ER ER ER

47,000 pF 473 K M DD DD DD DS ER ER ER ER EU GB GB GB GB

56,000 pF 563 K M DD DD DD ER ER ER ER EU GB GB GB GB

68,000 pF 683 K M DD DD DG DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB

82,000 pF 823 K M DD DD DG ER ER ER ER EU FX FX FX FX FX GB GB GB GB

0.10 µF 104 K M DG DG DG ER ER ER ER EU FX FX FX FX FZ GB GB GB GB

0.12 µF 124 K M DG DG ER ER ER ER FX FX FX FX FZ GB GB GB GB

0.15 µF 154 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB

0.18 µF 184 K M DG DG ER ER ER EU FX FX FX FX FU GB GB GB GB

0.22 µF 224 K M DG DD DG ER ER ER ES FX FX FX FZ FS GB GB GB GC

0.27 µF 274 K M DD DD ER ER ER FX FX FX FZ GB GB GB GF

0.33 µF 334 K M DD DG EU EU EU EU FX FX FX FU GB GB GB GK

0.39 µF 394 K M DD DG EU EU FX FX FZ FU GB GB GB GL

0.47 µF 474 K M DS DG EU EU ER FX FX FZ FJ GB GB GC

0.56 µF 564 K M EU FX FX FZ FR GB GB GD

0.68 µF 684 K M DG EU FX FZ FU FR GD GD GF

0.82 µF 824 K M EU FX FZ FU FR GD GD GK

1.0 µF 105 K M EU ER EH FX FU FJ FS GN GN GM

1.2 µF 125 K M FZ

1.5 µF 155 K M FU

1.8 µF 185 K M FU

2.2 µF 225 K M ER EH FJ FM FM

2.7 µF 275 K M

3.3 µF 335 K M FM

3.9 µF 395 K M

4.7 µF 475 K M EH FZ FM GK GK

6.8 µF 685 K M FS FS

Capacitance Capacitance

Code

Rated Voltage (VDC) 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200

Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2

Case Size/ Series C0805F/J C1206F/J C1210F/J C1812F/J

ammm Compancnls KEIVIEI' Emma): DP 08 D0 ER ES EH EU FX FZ FU FM FJ FR FS GB GD GD GF GK GN GL GM 0805 0805 0805 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 09010.10" 1.001020 1.251015 0.901020 1.001020 1.50 1 0 20 1.50 1 0 25 0.95 1 0 20 1.25 1 0 20 1.55 1 0 20 17010.20 1.351020 2.251020 2.501030 1.001010 1.101010 12510.15 1.501010 1.50 1 0 20 170 1 0.20 18010.20 20010.20 4,000 o oooooooooooooooooooo 15,000 oomoocoooooocccccoooo 2,500 2,500 4,000 2,500 2,000 2,000 4,000 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 10,000 10,000 10,000 10,000 0,000 0,000 10,000 10,000 0,000 0,000 0,000 0,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2 000

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities - Standard Termination

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

0805

0.90 ± 0.10*

4,000

15,000

0805

1.00 ± 0.20

2,500

10,000

0805

1.25 ± 0.15

2,500

10,000

1206

0.90 ± 0.20

4,000

10,000

1206

1.00 ± 0.20

2,500

10,000

1206

1.60 ± 0.20

2,000

8,000

1206

1.60 ± 0.25

2,000

8,000

1210

0.95 ± 0.20

4,000

10,000

1210

1.25 ± 0.20

2,500

10,000

1210

1.55 ± 0.20

2,000

8,000

1210

1.70 ± 0.20

2,000

8,000

1210

1.85 ± 0.20

2,000

8,000

1210

2.25 ± 0.20

2,000

8,000

1210

2.50 ± 0.30

1,000

4,000

1812

1.00 ± 0.10

1,000

4,000

1812

1.10 ± 0.10

1,000

4,000

1812

1.25 ± 0.15

1,000

4,000

1812

1.50 ± 0.10

1,000

4,000

1812

1.60 ± 0.20

1,000

4,000

1812

1.70 ± 0.20

1,000

4,000

1812

1.90 ± 0.20

500

2,000

1812

2.00 ± 0.20

500

2,000

Thickness

Code

Case

Size

Thickness ±

Range (mm)

7" Reel 13" Reel 7" Reel 13" Reel

Paper Quantity Plastic Quantity

Package quantity based on finished chip thickness specifications.

ammm Compancnls KEIVIEI' Emma): DD 08 D0 ER ES EH EU FX FZ FU FM FJ FR FS GB GD GD GF GK GN GL GM 0805 0805 0805 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 1812 1812 03010.10 1.001020 1.251015 0.901020 1.001020 1.50 1 0 20 1.50 1 0 25 0.95 1 0 20 1.25 1 0 20 1.55 1 0 20 17010.20 1.351020 2.251020 2.501030 1.001010 1.101010 12510.15 1.501010 1.50 1 0 20 170 1 0.20 18010.20 20010.20 oooooooooooooooooooooo ooeeoooooooocccccooooo 4,000 2,500 2,500 4,000 2,500 2,000 2,000 4,000 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 500 500 10,000 10,000 10,000 10,000 10,000 0,000 0,000 10,000 10,000 0,000 0,000 0,000 0,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 2,000 2 000

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 2B – Chip Thickness/Tape & Reel Packaging Quantities - Flexible Termination

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

0805

0.90 ± 0.10

4,000

10,000

0805

1.00 ± 0.20

2,500

10,000

0805

1.25 ± 0.15

2,500

10,000

1206

0.90 ± 0.20

4,000

10,000

1206

1.00 ± 0.20

2,500

10,000

1206

1.60 ± 0.20

2,000

8,000

1206

1.60 ± 0.25

2,000

8,000

1210

0.95 ± 0.20

4,000

10,000

1210

1.25 ± 0.20

2,500

10,000

1210

1.55 ± 0.20

2,000

8,000

1210

1.70 ± 0.20

2,000

8,000

1210

1.85 ± 0.20

2,000

8,000

1210

2.25 ± 0.20

2,000

8,000

1210

2.50 ± 0.30

1,000

4,000

1812

1.00 ± 0.10

1,000

4,000

1812

1.10 ± 0.10

1,000

4,000

1812

1.25 ± 0.15

1,000

4,000

1812

1.50 ± 0.10

1,000

4,000

1812

1.60 ± 0.20

1,000

4,000

1812

1.70 ± 0.20

1,000

4,000

1812

1.90 ± 0.20

500

2,000

1812

2.00 ± 0.20

500

2,000

Thickness

Code

Case

Size

Thickness ±

Range (mm)

7" Reel 13" Reel 7" Reel 13" Reel

Paper Quantity Plastic Quantity

Package quantity based on finished chip thickness specifications.

ammmc compmm KEIVIEI' crummy:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 2C – Bulk Packaging Quantities

Packaging Type Loose Packaging

Bulk Bag (default)

Packaging C-Spec1N/A2

Case Size Packaging Quantities (pieces/unit packaging)

EIA (in) Metric (mm) Minimum Maximum

0402

1005

50,000

0603

1608

0805

2012

1206

3216

1210

3225

1808

4520

20,000

1812

4532

1825

4564

2220

5650

2225

5664

1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

E‘ucuomc Compcnonu KEIWEI' CHARGED!

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70

1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00

1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90

121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00

1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70

1 Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

C C

X X

Grid Placement Courtyard

E‘ucuomc Compcnonu K CHARGED!

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81

1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16

1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11

1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

C C

X X

Grid Placement Courtyard

Eiecxmmc Compancnls KEIVIEI' mama): 5mm 5mm Smax Smax 3°C/second 3°C/second maximum maximum (VG/second (VG/second maximum maximum

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reflow only

Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/

J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes

at these conditions.

Profile Feature Termination Finish

SnPb 100% Matte Sn

Preheat/Soak

Temperature Minimum (TSmin)

100°C

150°C

Temperature Maximum (T

Smax

)150°C 200°C

Time (tS) from TSmin to TSmax

60 – 120 seconds

Ramp-Up Rate (TL to TP)

3°C/second

maximum

3°C/second

maximum

Liquidous Temperature (TL)183°C 217°C

Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds

Peak Temperature (TP)235°C 260°C

Time Within 5°C of Maximum

Peak Temperature (t

)

20 seconds

maximum

30 seconds

maximum

Ramp-Down Rate (TP to TL)

6°C/second

maximum

6°C/second

maximum

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

Temperature

Tsmin

Tsmax

TPMaximum Ramp Up Rate = 3°C/second

Maximum Ramp Down Rate = 6°C/second

25°C to Peak

Einctmmc Componcnl: KEIl/IEI' EHARGED! 1,000 Cycles (755"C 1o +125’C). Measurement a1 24 hours +/7 4 hours afrer test conclusion Load Humidity: 1,000 hours 85"Cl85% RH and rated voltage. Add 100 K ohm resistor. Measurement a1 24 hours +/7 4 hours afrer test conclusion, Low Volt Humidny: 1,000 hours SEC/85% RH and 1.5 V, Add 100 K ohm resisror. Measurement a1 24 hours +/7 4 hours afrer test conclusion, M|L7STD7202 Method 106 t = 24 hours/cycle. Steps 7a and 71) not required. M|L7STD7202 Method 107 755"C/+125’C. Note: Number of cycles required 7 300, maximum transierrrme 7 20 M|L7STD7202 Method 103 /E|A7198 M|L7STD7202 Method 103 5 g‘s tor 20 min, 12 c cles each o13 orientations. Note: Use 0" X 5" PCB 0.031" thick 7 secure poims on one ong side and 2 secure poims at corners of a mounted wnhin 2" from any secure point, Test from 10 7 2,000 Hz M|L7STD7202 Method 213 M|L7STD7202 Method 215

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress Reference Test or Inspection Method

Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex JIS–C–6429

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Solderability J–STD–002

Magnification 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

c) Method D, category 3 at 260°C

Temperature Cycling JESD22 Method JA–104

1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test

conclusion.

Biased Humidity MIL–STD–202 Method

103

Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours +/− 4 hours after test conclusion.

Moisture Resistance

MIL–STD–202 Method

106

t = 24 hours/cycle. Steps 7a and 7b not required.

Measurement at 24 hours +/− 4 hours after test conclusion.

Thermal Shock

MIL–STD–202 Method

107

−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20

seconds, dwell time – 15 minutes. Air – Air.

High Temperature Life

MIL–STD–202 Method

108

/EIA–198

1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.

Storage Life

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

Vibration MIL–STD–202 Method

204

5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7

secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz

Mechanical Shock

MIL–STD–202 Method

213

Figure 1 of Method 213, Condition F.

Resistance to Solvents

MIL–STD–202 Method

215

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

.................... CHARGED!

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Construction – Standard Termination

Dielectric

Material (BaTiO3)

Detailed Cross Section

Barrier Layer

(Ni)

Inner Electrodes

(Ni)

Inner Electrodes

(Ni)

Dielectric Material

(BaTiO3)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

End Termination/

External Electrode

(Cu)

Construction – Flexible Termination

Dielectric

Material (BaTiO3)

Detailed Cross Section

Inner Electrodes

(Ni)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

Dielectric Material

(BaTiO3)

Epoxy Layer

(Ag)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Epoxy Layer

(Ag)

End Termination/

External Electrode

(Cu)

summc Con-pan m KEIVIEI' CHARGED.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional):

These surface mount multilayer ceramic capacitors are

normally supplied unmarked. If required, they can be

marked as an extra cost option. Marking is available

on most KEMET devices but must be requested using

the correct ordering code identifi er(s). If this option is

requested, two sides of the ceramic body will be laser

marked with a “K” to identify KEMET, followed by two

characters (per EIA–198 - see table below) to identify the

capacitance value. EIA 0603 case size devices are limited

to the “K” character only.

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices.

• EIA 0402 case size devices.

• EIA 0603 case size devices with Flexible Termination

option.

• KPS Commercial and Automotive Grade stacked

devices.

• X7R dielectric products in capacitance values outlined

below.

Marking appears in legible contrast. Illustrated below

is an example of an MLCC with laser marking of “KA8”,

which designates a KEMET device with rated capacitance

of 100 µF. Orientation of marking is vendor optional.

KEMET

2-Digit

Capacitance

Code

EIA Case Size Metric Size Code Capacitance

0603

1608

≤ 170 pF

0805

2012

≤ 150 pF

1206

3216

≤ 910 pF

1210

3225

≤ 2,000 pF

1808

4520

≤ 3,900 pF

1812

4532

≤ 6,700 pF

1825

4564

≤ 0.018 µF

2220

5650

≤ 0.027 µF

2225

5664

≤ 0.033 µF

ammmc Compononl: KEIWEI' cums): -acitance F Fur Varinus AI halNumeralldentiﬁers

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identifi ers

Alpha

Character

Numeral

Capacitance (pF)

0.10

1.0

100

1,000

10,000

100,000

1,000,000

10,000,000

100,000,000

B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000

0.12

1.2

120

1,200

12,000

120,000

1,200,000

12,000,000

120,000,000

0.13

1.3

130

1,300

13,000

130,000

1,300,000

13,000,000

130,000,000

0.15

1.5

150

1,500

15,000

150,000

1,500,000

15,000,000

150,000,000

0.16

1.6

160

1,600

16,000

160,000

1,600,000

16,000,000

160,000,000

G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000

0.20

2.0

200

2,000

20,000

200,000

2,000,000

20,000,000

200,000,000

0.22

2.2

220

2,200

22,000

220,000

2,200,000

22,000,000

220,000,000

0.24

2.4

240

2,400

24,000

240,000

2,400,000

24,000,000

240,000,000

0.27

2.7

270

2,700

27,000

270,000

2,700,000

27,000,000

270,000,000

M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000

0.33

3.3

330

3,300

33,000

330,000

3,300,000

33,000,000

330,000,000

0.36

3.6

360

3,600

36,000

360,000

3,600,000

36,000,000

360,000,000

0.39

3.9

390

3,900

39,000

390,000

3,900,000

39,000,000

390,000,000

0.43

4.3

430

4,300

43,000

430,000

4,300,000

43,000,000

430,000,000

S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000

0.51

5.1

510

5,100

51,000

510,000

5,100,000

51,000,000

510,000,000

0.56

5.6

560

5,600

56,000

560,000

5,600,000

56,000,000

560,000,000

0.62

6.2

620

6,200

62,000

620,000

6,200,000

62,000,000

620,000,000

0.68

6.8

680

6,800

68,000

680,000

6,800,000

68,000,000

680,000,000

X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000

0.82

8.2

820

8,200

82,000

820,000

8,200,000

82,000,000

820,000,000

0.91

9.1

910

9,100

91,000

910,000

9,100,000

91,000,000

910,000,000

0.25

2.5

250

2,500

25,000

250,000

2,500,000

25,000,000

250,000,000

0.35

3.5

350

3,500

35,000

350,000

3,500,000

35,000,000

350,000,000

d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000

0.45

4.5

450

4,500

45,000

450,000

4,500,000

45,000,000

450,000,000

0.50

5.0

500

5,000

50,000

500,000

5,000,000

50,000,000

500,000,000

0.60

6.0

600

6,000

60,000

600,000

6,000,000

60,000,000

600,000,000

0.70

7.0

700

7,000

70,000

700,000

7,000,000

70,000,000

700,000,000

t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000

0.90

9.0

900

9,000

90,000

900,000

9,000,000

90,000,000

900,000,000

ammm Compancnls KEIVIEI' Emma): Bmm.12mm 173 mm (7 w») mmmm camenape KPS1812 and 2220

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

8 mm, 12 mm

or 16 mm carrier tape

178 mm (7.00")

330 mm (13.00")

Anti-static reel

Embossed plastic* or

punched paper carrier.

Embossment or punched cavity

Anti-static cover tape

(0.10 mm (0.004") maximum thickness)

Chip and KPS orientation in pocket

(except 1825 commercial, and 1825 and 2225 Military)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

KEMET

Bar code label

Sprocket holes

Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)

EIA Case Size

Tape

Size

(W)*

Embossed Plastic Punched Paper

7" Reel 13" Reel 7" Reel 13" Reel

Pitch (P

)* Pitch (P

01005 – 0402 8 2 2

0603 82/4 2/4

0805 84444

1206 – 1210 84444

1805 – 1808 12 4 4

≥ 1812 12 8 8

KPS 1210 12 8 8

KPS 1812

and 2220

16 12 12

Array 0612 844

*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance specifi cations.

New 2 mm Pitch Reel Options*

Packaging

Ordering Code

(C-Spec)

Packaging Type/Options

C-3190

Automotive grade 7" reel unmarked

C-3191

Automotive grade 13" reel unmarked

C-7081

Commercial grade 7" reel unmarked

C-7082

Commercial grade 13" reel unmarked

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changes and increased eﬃ ciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Center Lines of Cavity

User Direction of Unreeling

Cover Tape

is for tape feeder reference only,

including draft concentric about Bo.

ØD

ØDo

Embossment

For cavity size,

see Note 1 Table 4

[10 pitches cumulative

tolerance on tape ±0.2 mm]

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0

Minimum

Note 1

E1P0 P2

R Reference

Note 2

Minimum

Note 3

Maximum

8 mm

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.0

(0.039)

1.75 ±0.10

(0.069 ±0.004) 4.0 ±0.10

(0.157 ±0.004) 2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

0.600

(0.024) 0.600

(0.024) 0.100

(0.004)

12 mm 1.5

(0.059) 30

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch

Maximum

Note 4

Minimum

F P1

Maximum

A0,B0 & K0

8 mm Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.5

(0.098)

8.3

(0.327)

Note 512 mm Single (4 mm)

and Double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05

(0.138 ±0.002)

12.0 ±0.10

(0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity defi ned by A0, B0 and K0 shall surround the component with suﬃ cient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

ammm Compancnls KEIVI summer T ' I" "I f 40> 0 Q 9 0?. j I) T'WLL’ A / Ii4 ) 1 \ \ ‘ J/ K J — RRefevence NmeZ 0.10 (0004) Maximum 2.010 05 8.3 (0.079 :0 002) (0.327) 4.010.“) 83 (0.157 :0 004) (0.327)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

User Direction of Unreeling

Top Cover Tape

Center Lines of Cavity

ØDo Po E1

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

[10 pitches cumulative

tolerance on tape ±0.2 mm]

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0E1P0P2T1 Maximum G Minimum

R Reference

Note 2

8 mm 1.5 +0.10 -0.0

(0.059 +0.004 -0.0) 1.75 ±0.10

(0.069 ±0.004) 4.0 ±0.10

(0.157 ±0.004) 2.0 ±0.05

(0.079 ±0.002)

0.10

(0.004)

Maximum

0.75

(0.030) 25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0

8 mm Half (2 mm) 6.25

(0.246) 3.5 ±0.05

(0.138 ±0.002)

2.0 ±0.05

(0.079 ±0.002)

1.1

(0.098)

8.3

(0.327)

Note 1

8 mm Single (4 mm)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

1. The cavity defi ned by A0, B0 and T shall surround the component with suﬃ cient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape Maximum

Width (mm) Rotation (°

8,12 20

16 – 200 10 Tape Maximum

Width (mm) Rotation ( °

8,12 20

16 – 56 10

72 – 200 5

Typical Pocket Centerline

Typical Component Centerline

Figure 4 – Maximum Lateral Movement

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

16 mm Tape

Figure 5 – Bending Radius

Bending

Radius

Embossed

Carrier

Punched

Carrier

ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

AD(See Note)

Full Radius,

See Note

B(see Note)

Access Hole at

Slot Location

(Ø 40 mm minimum)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

W3 (Includes

flange distortion

at outer edge)

W2 (Measured at hub)

W1 (Measured at hub)

(Arbor hole

diameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size A B Minimum CD Minimum

8 mm 178 ±0.20

(7.008 ±0.008)

330 ±0.20

(13.000 ±0.008)

1.5

(0.059) 13.0 +0.5/−0.2

(0.521 +0.02/−0.008) 20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size N Minimum W1 W2 Maximum W3

8 mm

(1.969)

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

Shall accommodate tape

width without interference

12 mm

12.4 +2.0/−0.0

(0.488 +0.078/−0.0)

18.4

(0.724)

16 mm

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

22.4

(0.882)

EHARGED! 1 ﬁ%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099ﬂ/60ﬁ999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggﬁ1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Trailer

160 mm minimum

Carrier Tape

END START

Round Sprocket Holes

Elongated Sprocket Holes

(32 mm tape and wider)

Top Cover Tape

Punched Carrier

8 mm & 12 mm only

Embossed Carrier

Components

100 mm

minimum Leader

400 mm minimum

Figure 8 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Elongated Sprocket Holes

(32 mm & wider tapes)

ammmc compmm KEIVIEI' cumin:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

KEMET Electronics Corporation Sales Oﬃ ces

For a complete list of our global sales oﬃ ces, please visit www.kemet.com/sales.

Disclaimer

All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

FO-CAP, X7R Dielectric 16-200 VDC Datasheet by KEMET

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