ADG936(-R) Datasheet by Analog Devices Inc.

ANALOG DEVICES
Wideband 4 GHz, 36 dB Isolation at 1 GHz,
CMOS, 1.65 V to 2.75 V, Dual SPDT
Data Sheet ADG936/ADG936-R
Rev. B Document Feedback
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FEATURES
Wideband switch: −3 dB @ 4 GHz
ADG936 absorptive dual SPDT
ADG936-R reflective dual SPDT
High off isolation (36 dB @ 1 GHz)
Low insertion loss (0.9 dB dc to 1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
20-lead TSSOP and 4 mm × 4 mm LFCSP packages
Low power consumption (1 μA maximum)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
FUNCTIONAL BLOCK DIAGRAMS
INB
RF1B
RF2B
RFCB
ADG936
INA
RF1A
RF2A
RFCA 50
50
50
50
04503-001
INA
INB
RF1A
RF2A
RF1B
RF2B
RFCB
RFCA
ADG936-R
04503-012
Figure 1. Figure 2.
GENERAL DESCRIPTION
The ADG936/ADG936-R are wideband analog switches that
comprise two independently selectable SPDT switches using a
CMOS process to provide high isolation and low insertion loss
to 1 GHz. The ADG936 is an absorptive/matched dual SPDT
with 50 Ω terminated shunt legs; the ADG936-R is a reflective
dual SPDT. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, eliminating the need for external controlling
circuitry. The control inputs are both CMOS and LVTTL
compatible. The low power consumption of these CMOS
devices makes them ideally suited for wireless applications and
general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. –36 dB off isolation @ 1 GHz.
2. 0.9 dB insertion loss @ 1 GHz.
3. 20-lead TSSOP and 4 mm × 4 mm LFCSP packages.
04503-027
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
OFF ISOLATION (dB)
–10
–20
–30
–40
–50
–60
–70
–80
S12
S21
V
DD
= 2.5V
T
A
= 25°C
Figure 3. Off Isolation vs. Frequency
04503-015
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
V
DD
= 2.5V
T
A
= 25°C
Figure 4. Insertion Loss vs. Frequency
ADG936/ADG936-R Data Sheet
Rev. B | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagrams ............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
ESD Caution .................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Terminology ...................................................................................... 6
Typical Performance Characteristics ..............................................7
Test Circuits ........................................................................................9
Applications ..................................................................................... 11
Absorptive vs. Reflective ........................................................... 11
Filter Selection ............................................................................ 11
Tx/Rx Switching ......................................................................... 11
Antenna Diversity Switch .......................................................... 11
Evaluation Board ............................................................................ 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 14
REVISION HISTORY
4/13—Rev. A to Rev. B
Changed CP-20-1 to CP-20-6 ........................................... Universal
Added EPAD Note ............................................................................ 5
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 14
8/05—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................ 3
Changes to Figure 6 .......................................................................... 5
Changes to Ordering Guide .......................................................... 14
7/04—Revision 0: Initial Version
Table L
Data Sheet ADG936/ADG936-R
Rev. B | Page 3 of 16
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted.1
Table 1.
B Version
Parameter Symbol Conditions Min Typ 2 Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency3 DC 2 GHz
3 dB Frequency4 4 GHz
Input Power4 0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.5 dB
500 MHz; VDD = 2.5 V ± 10% 0.6 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.9 1.25 dB
Isolation—RFCx to RF1x/RF2x S21, S12 100 MHz 52 60 dB
500 MHz
40
47
dB
1000 MHz
31
36
dB
Crosstalk—RF1x to RF2x S21, S12 100 MHz 53 69 dB
500 MHz 42 45 dB
1000 MHz 34 37 dB
Return Loss (On Channel)4 S11, S22 DC to 100 MHz 20 25 dB
500 MHz 19 23 dB
1000 MHz 16 24 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 24 dB
500 MHz 17 23 dB
1000 MHz 16 21 dB
On Switching Time4 tON 50% CTRL to 90% RF 11 14 ns
Off Switching Time
4
t
OFF
50% CTRL to 10% RF
10
13
ns
Rise Time4 tRISE 10% to 90% RF 6.1 8 ns
Fall Time4 tFAL L 90% to 10% RF 6 8 ns
1 dB Compression4 P–1 dB 1000 MHz 16 dBm
Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 27.5 32 dBm
Video Feedthrough5 3 mV p-p
DC ELECTRICAL CHARACTERISTICS
Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V
VINH VDD = 1.65 V to 1.95 V 0.65 VCC V
Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V
VINL VDD = 1.65 V to 1.95 V 0.35 VCC V
Input Leakage Current II 0 ≤ VIN ≤ 2.75 V ± 0.1 ± 1 µA
CAPACITANCE4
RF Port On Capacitance CRF ON f = 1 MHz 2.5 pF
Digital Input Capacitance CDIG f = 1 MHz 2 pF
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 µA
1 Temperature range of B Version: −40°C to +85°C.
2 Typical values are at VDD = 2.5 V and 25°C, unless otherwise noted.
3 Operating frequency is the point at which insertion loss degrades by 1 dB.
4 Guaranteed by design, not subject to production test.
5 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or from low to high in a 50 Ω test
setup, measured with 1 ns rise time pulses and a 500 MHz bandwidth.
Table 2‘ Table 3‘ Truth Table $6! @
ADG936/ADG936-R Data Sheet
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VDD to GND –0.5 V to +4 V
Inputs to GND –0.5 V to VDD + 0.3 V1
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature 150°C
TSSOP Package
θJA Thermal Impedance 143°C/W
LFCSP Package
θJA Thermal Impedance (4-Layer Board) 30.4°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
Table 3. Truth Table
INx RF1x RF2x
0 Off On
1 On Off
1 RF1x/RF2x off port inputs to ground = –0.5 V to VDD – 0.5 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
proprietary ESD protection circuitry, permanent damage may occur on
degradation or loss of functionality.
W—VflW—VWW—Vflfl LLLLLLLLILLI
Data Sheet ADG936/ADG936-R
Rev. B | Page 5 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
20
19
18
17
16
15
14
13
V
DD
GND
RF1A
GND
GND
RF1B
GND
GND
INA
GND
RF2A
GND
GND
RF2B
GND
ADG936
ADG936-R
TOP VIEW
(Not to Scale)
RFC
A
9
10
12
11
GND
RFCB
INB
GND
04503-002
04503-003
NOTES
1. EXPOSED PAD TIED TO SUBSTATE, GND.
14
13
12
1
3
4
RF2A
15 GND
GND
GND
11 RF2B
GND
GND
2
RF1A
GND
5
RF1B
7
GND
6
GND
8
RFCB
9
GND
10
INB
19 V
DD
20 GND
18 RFC
A
17 GND
16 INA
ADG936
ADG936-R
TOP VIEW
(Not to Scale)
Figure 5. 20-Lead TSSOP (RU-20) Figure 6. 20-Lead 4 mm × 4 mm LFCSP (CP-20-1)
Table 4. Pin Function Descriptions
Pin No.
20-Lead
TSSOP
20-Lead
LFCSP Mnemonic Description
1 18 RFCA Common RF Port for Switch A.
2 19 VDD Power Supply Input. These parts can operate from 1.65 V to 2.75 V. VDD should be decoupled
to GND.
3, 5, 6, 8, 9,
11, 13, 15,
16, 18, 20
1, 3, 4, 6, 7,
9, 12, 13,
15, 17, 20
GND Ground Reference Point for All Circuitry on the Part.
4 2 RF1A RF1A Port.
7 5 RF1B RF1B Port.
10 8 RFCB Common RF Port for Switch B.
12 10 INB Logic Control Input.
14 11 RF2B RF2B Port.
17 14 RF2A RF2A Port.
19 16 INA Logic Control Input.
EP EP Exposed Pad. The exposed pad must be tied to substrate, GND.
Table 5‘
ADG936/ADG936-R Data Sheet
Rev. B | Page 6 of 16
TERMINOLOGY
Table 5.
Parameter Description
VDD Most Positive Power Supply Potential.
I
DD
Positive Supply Current.
GND Ground (0 V) Reference.
INx Logic Control Input.
VINL Maximum Input Voltage for Logic 0.
VINH Minimum Input Voltage for Logic 1.
I
INL
(I
INH
)
Input Current of the Digital Input.
CIN Digital Input Capacitance.
tON Delay Between Applying the Digital Control Input and the Output Switching On.
tOFF Delay Between Applying the Digital Control Input and the Output Switching Off.
tRISE Rise Time. Time for the RF signal to rise from 10% of the on level to 90% of the on level.
tFAL L Fall Time. Time for the RF signal to fall from 90% of the on level to 10% of the on level.
Off Isolation The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the Off
Condition.
Insertion Loss The Attenuation Between Input and Output Ports of the Switch When the Switch Control Voltage Is in the On
Condition.
Crosstalk Measure of Unwanted Signal Coupled Through from One Channel to Another as a Result of Parasitic Capacitance.
P–1 dB 1 dB Compression Point. The RF input power level at which the switch insertion loss increases by 1 dB over its low level
value. P–1 dB is a measure of how much power the on switch can handle before the insertion loss increases by 1 dB.
IP3 Third-Order Intermodulation Intercept. This is a measure of the power in false tones that occurs when closely spaced
tones are passed through a switch, whereby the nonlinearity of the switch causes these false tones to be generated.
Return Loss The Amount of Reflected Power Relative to the Incident Power at a Port. Large return loss indicates good matching. By
measuring return loss, the voltage standing wave ratio (VSWR) can be calculated from conversion charts. VSWR
indicates the degree of matching present at a switch RF port.
Video Feedthrough Spurious Signals Present at the RF Ports of the Switch When the Control Voltage Is Switched from High to Low or from
Low to High Without an RF Signal Present.
Data Sheet ADG936/ADG936-R
Rev. B | Page 7 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
04503-015
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0
V
DD
= 2.25V
V
DD
= 2.50V
V
DD
= 2.75V
T
A
= 25°C
Figure 7. Insertion Loss vs. Frequency over Supplies
(S12 and S21)
04503-016
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.5
–0.4
–0.6
–0.7
–0.8
–0.9
–1.0
V
DD
= 2.25V
V
DD
= 2.50V
V
DD
= 2.75V
T
A
= 25°C
Figure 8. Insertion Loss vs. Frequency over Supplies
(S12 and S21) (Zoomed Figure 7)
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.8
–0.7
–0.6
–0.5
–0.4
–1.2
–1.1
–1.0
–0.9
–1.7
–2.2
–2.1
–2.0
–1.9
–1.8
–1.6
–1.5
–1.4
–1.3
–2.3
–2.4
–2.5
–2.6
–2.7
–2.9
–2.8
–3.0
V
DD
= 1.65V
V
DD
= 1.80V
V
DD
= 1.95V
T
A
= 25°C
04503-017
Figure 9. Insertion Loss vs. Frequency over Supplies
(S12 and S21)
04503-018
FREQUENCY (Hz)
10G
10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.8
–0.7
–0.6
–0.5
–0.4
–1.2
–1.1
–1.0
–0.9
–1.7
–2.2
–2.1
–2.0
–1.9
–1.8
–1.6
–1.5
–1.4
–1.3
–2.3
–2.4
–2.5
–2.6
–2.7
–2.9
–2.8
–3.0 V
DD
= 2.5V
T
A
= –40°C
T
A
= +25°C
T
A
= +85°C
Figure 10. Insertion Loss vs. Frequency over Temperature
(S12 and S21)
04503-019
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
OFF ISOLATION (dB)
–10
–20
–30
–40
–50
–60
–70
–80
S12
S21
V
DD
= 1.65V TO 2.75V
T
A
= 25°C
Figure 11. Isolation vs. Frequency over Supplies
04503-020
FREQUENCY (Hz)
10G1G10k 100k 1M 10M 100M
OFF ISOLATION (dB)
–10
–30
–20
–50
–40
–70
–60
–90
–80
–100
–110
T
A
= –40°C
T
A
= +85°C
T
A
= +25°C
V
DD
= 2.5V
Figure 12. Isolation vs. Frequency over Temperature
ADG936/ADG936-R Data Sheet
Rev. B | Page 8 of 16
04503-021
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
RETURN LOSS (dB)
0
–5
–10
–15
–20
–25
–30
V
DD
= 2.5V
T
A
= 25°C
OFF SWITCH
ON SWITCH
Figure 13. Return Loss vs. Frequency ( S11)
04503-022
FREQUENCY (Hz)
10G10k 100k 1M 10M 100M 1G
CROSSTALK (dB)
–10
–20
–30
–40
–50
–60
–70
–80
–90
V
DD
= 2.5V
T
A
= 25°C
Figure 14. Crosstalk vs. Frequency (S12 and S21)
04503-023
T
[]
CH1 CH2 5.00ns
CH3 1.00V
100mV 100mV
1
3
TEK RUN: 5.00GS/s ET ENVELOPE
INx
RFx
Figure 15. Switch Timing
04503-024
CH3 1.00mV
CH1 1.00V20.0ns
: 2.20mV
1
3
T
TEK RUN []
RFCx
INx
T
TRIG'D
Figure 16. Video Feedthrough
04503-028
FREQUENCY (MHz)
900100 200 300 400 500 600 700 800
IP
3
(dB)
35
30
25
20
15
10
5
0
V
DD
= 2.5V
T
A
= 25°C
Figure 17. IP3 vs. Frequency
04503-025
FREQUENCY (MHz)
15000 250 500 750 1000 1250
P
–1dB
(dBm)
18
14
16
12
10
6
8
2
4
0
V
DD
= 2.5V
T
A
= 25°C
Figure 18. P–1 dB vs. Frequency
Data Sheet ADG936/ADG936-R
Rev. B | Page 9 of 16
TEST CIRCUITS
Similar setup for the ADG936. Additional pins omitted for clarity.
t
ON
50% 50%
90% 10%
V
INx
V
OUT
t
OFF
10F
V
S
INx
RFx
RFCx
R
L
50
V
OUT
GND
V
DD
V
DD
04503-004
Figure 19. Switch Timing: tON, tOFF
V
INx
V
OUT
50% 50%
90% 90% 10%
10%
t
FALL
t
RISE
V
DD
V
DD
10F
V
S
INx
RFx
RFCx
GND
R
L
50
V
OUT
04503-005
Figure 20. Switch Timing: tRISE, tFALL
V
S
NETWORK
ANALYZER
V
INx
OFF ISOLATION = 20log V
OUT
V
S
V
DD
10F
V
DD
50
V
OUT
R
L
50
ADG936-R
RF2x
RF1x
INx
RFC
GND
50
04503-006
Figure 21. Off Isolation
V
S
NETWORK
ANALYZER
V
INx
INSERTION LOSS = 20log V
OUT
V
S
V
DD
10F
V
DD
50
V
OUT
R
L
50
ADG936-R
RF2x
RF1x
INx
RFCx
GND
50
04503-007
Figure 22. Insertion Loss
V
S
NETWORK
ANALYZER
V
INx
CROSSTALK = 20log V
OUT
V
S
V
DD
10F
V
DD
50
V
OUT
R
L
50
ADG936-R
RF2x
RF1x
INx
RFCx
GND
50
04503-008
Figure 23. Crosstalk
V
INx
V
DD
10F
V
DD
ADG936-R
RF2x
RF1x
INx
RFCx
NC
NC
OSCILLOSCOPE
GND
04503-009
Figure 24. Video Feedthrough
ADG936/ADG936-R Data Sheet
Rev. B | Page 10 of 16
SPECTRUM
ANALYZER
V
INx
V
DD
10F
V
DD
ADG936-R
RF2x
RF1x
INx
RFCx
GND
50
COMBINER
RF
SOURCE
RF
SOURCE
04503-010
Figure 25. IP3
SPECTRUM
ANALYZER
V
INx
V
DD
10F
V
DD
ADG936-R
RF2x
RF1x
INx
RFCx
GND
50
RF
SOURCE V
S
04503-011
Figure 26. P–1 dB
Data Sheet ADG936/ADG936-R
Rev. B | Page 11 of 16
APPLICATIONS
The ADG936/ADG936-R are ideal solutions for low power,
high frequency applications. The low insertion loss, high
isolation between ports, low distortion, and low current
consumption of these parts make them excellent solutions for
many high frequency switching applications. They can be used
in applications such as switchable filters, transmitters and
receivers for radar systems, and communication systems from
base stations to cell phones.
The ADG9xx family of wideband switches is designed to meet
the demands of devices transmitting at ISM band frequencies to
1 GHz and higher. The low insertion loss, high isolation
between ports, single pin control interface, no requirement for
dc blocking capacitors, and TTL interface compatibility make
them cost-effective and easy-to-integrate switching solutions for
many high frequency switching and low power applications,
because the parts can handle up to 16 dBm of power.
ABSORPTIVE VS. REFLECTIVE
The ADG936 is an absorptive (matched) switch with 50 Ω
terminated shunt legs; the ADG936-R is a reflective switch with
0 Ω terminated shunts to ground. The ADG936 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a
need for a good VSWR that is looking into the port but not
passing the through-signal to the common port. The ADG936
is, therefore, ideal for applications that require minimum
reflections back to the RF source. It also ensures that the
maximum power is transferred to the load.
The ADG936-R reflective switch is suitable for applications in
which high off-port VSWR does not matter. The switch also has
some other desired performance features. It can be used in
many applications, including high speed filter selection. In most
cases, an absorptive switch can be used instead of a reflective
switch, but not vice versa.
FILTER SELECTION
The ADG936 and ADG936-R can be used to switch high
frequency signals between different filters and to multiplex the
signal to the output. These dual SPDT switches are also ideal for
high speed signal routing and for switching high speed differential
signals.
ADG936
ADG936
RF1A
RF2A
RF1B
RF2B
RF1A
RF2A
RF1B
RF2B
RFOUT
RFCA
RFOUT
RFCB
RFIN RFCB
RFIN RFCA
04503-013
Figure 27. Filter Selection
Tx/Rx SWITCHING
The low insertion loss and high isolation between ports ensure
that the ADG936/ADG936-R are suitable transmit/receive
switches for all ISM band and wireless LAN applications,
providing the required isolation between the transmit and
receive signals.
ANTENNA
ADG936
RF1B
RF2B
RF1B
RF2B
RFCB
RFCA PA
LNA
04504-014
Figure 28. Tx/Rx Switching
ANTENNA DIVERSITY SWITCH
The ADG936/ADG936-R are ideal for use as antenna diversity
switches, switching in different antennas to the tuner. The low
insertion loss, which ensures minimum signal loss and high
isolation between channels, makes these dual SPDT switches
suitable for switching applications in tuner modules and set-top
boxes.
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ADG936/ADG936-R Data Sheet
Rev. B | Page 12 of 16
EVALUATION BOARD
The ADG936 and ADG936-R evaluation board allows
designers to evaluate these high performance wideband
switches with minimal effort.
To prove that these devices meet the user’s requirements, only a
power supply and a network analyzer, along with the evaluation
board, are required. An application note available with the
evaluation board gives complete information on operating the
evaluation board.
The RFCA port is connected through a 50 Ω transmission line
to SMA Connector J3. The RFCB port is connected through a
50 Ω transmission line to SMA Connector J4. RF1A, RF2A,
RF1B, and RF2B are connected through 50 Ω transmission lines
to SMA Connectors J5, J6, J7, and J8, respectively. A through
transmission line connects J9 and J10; this transmission line is
used to estimate the loss of the PCB over the environmental
conditions being evaluated.
The board is constructed of a 4-layer FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062 in.
Two ground layers with grounded planes provide ground for
the RF transmission lines. The transmission lines were designed
using a coplanar waveguide with a ground plane model using a
trace width of 0.024 in, a clearance to ground plane of 0.008 in,
a dielectric thickness of 0.02 in, and a metal thickness of
0.0021 in.
04503-029
Figure 29. ADG936 and ADG936-R Evaluation Board Top View
Data Sheet ADG936/ADG936-R
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX 0.20
0.09 0.75
0.60
0.45
8°
0°
COPLANARIT
Y
0.10
Figure 30. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70 0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 31. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
ADG936/ADG936-R Data Sheet
Rev. B | Page 14 of 16
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
2
ADG936BRU –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCPZ –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-RL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-RL7 –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
EVAL-ADG936EBZ Evaluation Board RU-20
ADG936BRU-R
–40°C to +85°C
20-Lead Thin Shrink Small Outline Package (TSSOP)
RU-20
ADG936BRU-R-500RL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRU-R-REEL7 –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BRUZ-R –40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG936BCPZ-R –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADG936BCPZ-R-REEL –40°C to +85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
EVAL-ADG936REBZ Evaluation Board RU-20
1 Z = RoHS Compliant Part.
2 CP-20-6 package was formerly CP-20-1 package
Data Sheet ADG936/ADG936-R
Rev. B | Page 15 of 16
NOTES
a mum 3 Anilog Dtviax, Inn All "gm; .mmd. Yvademivkx ind ANALOG DEVICES www.analog.cnm
ADG936/ADG936-R Data Sheet
Rev. B | Page 16 of 16
NOTES
© 2004–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04503–0–4/13(B)