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TPA701 Datasheet by Texas Instruments
0 Wide Power Supply Compatibility
2-5 V - 5-5 V SHUTDOWNEE t0 a :El
0 Output Power for RL = a Q BYPASSEE 2 7 :El
— 7oo mw at vDD = 5 v, BTL IN+EE 3 6 It
— 250 mW at VDD = 3.3 V, BTL iN—El: 4 5 :El
0 Ultralow Quiescent Current in Shutdown
Mode . . . 1.5 nA
0 Thermal and Short-Circuit Protection
0 Surface-Mount Packaging
— SOIC
— PowerPAD MSOP
description
The TPA701 is a bridgertied load (BTL) audio power amplifier developed especiaily for Iowa
where internal speakers are required. Operating with a 3.37V supply, the TPA701 can
continuous power into a BTL 84) load at less than 0.6% THD+N throughout voice band fre
this device is characterized out to 20 kHz, its operation was optimized for narrower band a
wireless communications. The BTL configuration eliminates the need for external couplin
output in most applications, which is particuiariy important for small batteryrpowered equ
leatures a shutdown mode lor powerrsensitive appiications with a supply current of 1.5 n
The TPA701 is available in an 87pin SOIC surfacermount package and the surfacermoun
which reduces board space by 50% and height by 40%.
VDD 6
“F t ' L
Audio e vDD/z
tnput I
a e
' 4 'N‘ _ my 5
c. :t In. . f ’ ' ’ ’
+
L 2 BYPASS 1
ca T r
e j — vo— a
r r , b
i + 7
‘ GND
snuroown Bias i
From System Control Comm ,
Piease be aware that an important notice concerning avaliabllity‘ standard warranty, and use in
Texas instruments semiconductor products and disclaimers thereto appears at the end ol this data shee
mm”‘astatiisfizzm:inmatiizttucrmmz
imitating”. " 9 i TEXAS
INSTRUMENTS
POST OFFICE aox $55303 - DALLAS TEXAS 752s5
Copyright 1998 e 2003, Tex
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DFully Specified for 3.3-V and 5-V Operation
DWide Power Supply Compatibility
2.5 V – 5.5 V
DOutput Power for RL = 8 Ω
– 700 mW at VDD = 5 V, BTL
– 250 mW at VDD = 3.3 V, BTL
DUltralow Quiescent Current in Shutdown
Mode . . . 1.5 nA
DThermal and Short-Circuit Protection
DSurface-Mount Packaging
– SOIC
– PowerPAD MSOP
description
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of
continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as
wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the
output in most applications, which is particularly important for small battery-powered equipment. This device
features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.
The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP,
which reduces board space by 50% and height by 40%.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
1
2
4
BYPASS
IN –
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
VO–8
GND
From System Control
3 IN+
–
+
–
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1998 – 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
IN+
IN–
VO–
GND
VDD
VO+
D OR DGN PACKAGE
(TOP VIEW)
PowerPAD is a trademark of Texas Instruments.
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP
TASMALL OUTLINE†
(D) MSOP‡
(DGN)
MSOP
SYMBOLIZATION
–40°C to 85°C TPA701D TPA701DGN ABA
†In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW
peaks can be driven, as long as the RMS value is less than 350 mW.
‡The D and DGN packages are available taped and reeled. To order a taped and reeled part, add
the suffix R to the part number (e.g., TPA701DR).
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO. I/O DESCRIPTION
BYPASS 2 I BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to
a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier.
GND 7 GND is the ground connection.
IN–4 I IN– is the inverting input. IN– is typically used as the audio input terminal.
IN+ 3 I IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal.
SHUTDOWN 1 I SHUTDOWN places the entire device in shutdown mode when held high (IDD = 1.5 nA).
VDD 6 VDD is the supply voltage terminal.
VO+ 5 O VO+ is the positive BTL output.
VO–8 O VO– is the negative BTL output.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)§
Supply voltage, VDD 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI –0.3 V to VDD +0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation internally limited (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating junction temperature range, TJ –40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE TA ≤ 25°CDERATING FACTOR TA = 70°C TA = 85°C
D725 mW 5.8 mW/°C464 mW 377 mW
DGN 2.14 W¶17.1 mW/°C1.37 W 1.11 W
¶Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was
measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended
Board for PowerPAD on page 33 of the before mentioned document.
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN MAX UNIT
Supply voltage, VDD 2.5 5.5 V
High-level voltage, VIH SHUTDOWN 0.9 VDD V
Low-level voltage, VIL SHUTDOWN 0.1 VDD V
Operating free-air temperature, TA–40 85 °C
electrical characteristics at specified free-air temperature, VDD = 3.3 V, TA = 25°C (unless otherwise
noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOO|Output offset voltage (measured differentially) SHUTDOWN = 0 V, RL = 8 Ω, RF = 10 kΩ20 mV
PSRR Power supply rejection ratio VDD = 3.2 V to 3.4 V 85 dB
IDD Supply current SHUTDOWN = 0 V, RF = 10 kΩ1.25 2.5 mA
IDD(SD) Supply current, shutdown mode (see Figure 4) SHUTDOWN = VDD, RF = 10 kΩ1.5 1000 nA
|IIH|High-level input current SHUTDOWN, VDD = 3.3 V, VI = 3.3 V 1µA
|IIL|Low-level input current SHUTDOWN, VDD = 3.3 V, VI = 0 V 1µA
operating characteristics, VDD = 3.3 V, TA = 25°C, RL = 8 Ω
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POOutput power, see Note 1 THD = 0.2%, See Figure 9 250 mW
THD + N Total harmonic distortion plus noise AV = – 2 V/V,
PO = 250 mW f = 200 Hz to 4 kHz, See Figure 7, 0.55%
BOM Maximum output power bandwidth AV = – 2 V/V, THD = 2%, See Figure 7 20 kHz
B1Unity-gain bandwidth Open loop, See Figure 15 1.4 MHz
Supply ripple rejection ratio f = 1 kHz, CB = 1 µF, See Figure 2 79 dB
VnNoise output voltage AV = –1 V/V, CB = 0.1 µF, See Figure 19 17 µV(rms)
NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz.
electrical characteristics at specified free-air temperature, VDD = 5 V, TA = 25°C (unless otherwise
noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOO|Output offset voltage (measured differentially) SHUTDOWN = 0 V, RL = 8 Ω, RF = 10 kΩ20 mV
PSRR Power supply rejection ratio VDD = 4.9 V to 5.1 V 78 dB
IDD Supply current SHUTDOWN = 0 V, RF = 10 kΩ1.25 2.5 mA
IDD(SD) Supply current, shutdown mode (see Figure 4) SHUTDOWN = VDD, RF = 10 kΩ5 1500 nA
|IIH|High-level input current SHUTDOWN, VDD = 5.5 V, VI = VDD 1µA
|IIL|Low-level input current SHUTDOWN, VDD = 5.5 V, VI = 0 V 1µA
vDD/z
—>
“,_)}_.7
‘07
5
HP
VV
Bias 1
Control
q},
*9 TEXAS
INSTRUMENTS
4 POST OFFICE EOX $55303 ' DALLAS IEXAS 75285
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VDD = 5 V, TA = 25°C, RL = 8 Ω
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POOutput power THD = 0.5%, See Figure 13 700†mW
THD + N Total harmonic distortion plus noise AV = – 2 V/V,
PO = 700 mW f = 200 Hz to 4 kHz, See Figure 11, 0.5%
BOM Maximum output power bandwidth AV = – 2 V/V, THD = 2%, See Figure 11 20 kHz
B1Unity-gain bandwidth Open loop, See Figure 16 1.4 MHz
Supply ripple rejection ratio f = 1 kHz, CB = 1 µF, See Figure 2 80 dB
VnNoise output voltage AV = – 1 V/V, CB = 0.1 µF, See Figure 20 17 µV(rms)
†The DGN package, properly mounted, can conduct 700 mW RMS power continuously. The D package, can only conduct 350 mW RMS power
continuously, with peaks to 700 mW.
PARAMETER MEASUREMENT INFORMATION
Audio
Input
Bias
Control
VDD
6
5
7
VO+
VDD
1
2
4
BYPASS
IN –
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
VO–8
RL = 8 Ω
GND
3 IN+
–
+
–
+
Figure 1. BTL Mode Test Circuit
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Supply ripple rejection ratio vs Frequency 2
IDD Supply current vs Supply voltage 3, 4
P
Output power
vs Supply voltage 5
POOutput power vs Load resistance 6
THD N
Total harmonic distortion plus noise
vs Frequency 7, 8, 11, 12
THD+N Total harmonic distortion plus noise vs Output power 9, 10, 13, 14
Open loop gain and phase vs Frequency 15, 16
Closed loop gain and phase vs Frequency 17, 18
VnOutput noise voltage vs Frequency 19, 20
PDPower dissipation vs Output power 21, 22
Figure 2
–50
–60
–80
–10020 100 1k
–30
–20
f – Frequency – Hz
SUPPLY RIPPLE REJECTION RATIO
vs
FREQUENCY
0
10k 20k
–10
–40
–70
–90 VDD = 5 V
VDD = 3.3 V
RL = 8 Ω
CB = 1 µF
BTL
Supply Ripple Rejection Ratio – dB
Figure 3
VDD – Supply Voltage – V
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
1.8
0.8
0.6
1
34 5.5
5
IDD– Supply Current – mA
2.5 3.5 4.5
1.6
1.2
1.4
SHUTDOWN = 0 V
RF = 10 kΩ
\\
/\
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 4
VDD – Supply Voltage – V
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
3
2
0435
7
4
5
6
5.5
IDD– Supply Current – nA
8
9
10
1
3.52.5 4.5
SHUTDOWN = VDD
RF = 10 kΩ
Figure 5
VDD – Supply Voltage – V
OUTPUT POWER
vs
SUPPLY VOLTAGE
600
400
200
0
2.5 3.53 4 5.5
1000
P
4.5 5
O– Output Power – mW
800
THD+N 1%
f = 1 kHz
BTL
RL = 32 Ω
RL = 8 Ω
RL – Load Resistance – Ω
OUTPUT POWER
vs
LOAD RESISTANCE
300
200
100
016 3224 40 64
800
8
P
48 56
O– Output Power – mW
400
THD+N = 1%
f = 1 kHz
BTL
VDD = 5 V
500
600
VDD = 3.3 V
700
Figure 6
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 7
f – Frequency – Hz
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
AV = –2 V/V
VDD = 3.3 V
PO = 250 mW
RL = 8 Ω
BTL
20 1k 10k
1
0.01
10
0.1
20k100
AV = –20 V/V
AV =– 10 V/V
Figure 8
f – Frequency – Hz
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
PO = 125 mW
VDD = 3.3 V
RL = 8 Ω
AV = –2 V/V
BTL
20 1k 10k
1
0.01
10
0.1
20k100
PO = 50 mW
PO = 250 mW
Figure 9
PO – Output Power – W
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
0 0.15 0.4
1
0.01
10
0.1
0.2 0.25 0.3 0.35
VDD = 3.3 V
f = 1 kHz
AV = –2 V/V
BTL
0.05 0.1
RL = 8 Ω
Figure 10
PO – Output Power – W
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
f = 20 kHz
VDD = 3.3 V
RL = 8 Ω
CB = 1 µF
AV = –2 V/V
BTL
0.01 0.1 1
1
0.01
10
0.1
f = 1 kHz
f = 10 kHz
f = 20 Hz
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 11
f – Frequency – Hz
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
AV = –2 V/V
VDD = 5 V
PO = 700 mW
RL = 8 Ω
BTL
20 1k 10k
1
0.01
10
0.1
20k100
AV = –20 V/V
AV = –10 V/V
Figure 12
f – Frequency – Hz
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
FREQUENCY
PO = 700 mW
VDD = 5 V
RL = 8 Ω
AV = –2 V/V
BTL
20 1k 10k
1
0.01
10
0.1
20k100
PO = 50 mW
PO = 350 mW
Figure 13
PO – Output Power – W
0.1 0.2 10.4 0.5 0.7 0.8
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
RL = 8 Ω
VDD = 5 V
f = 1 kHz
AV = –2 V/V
BTL
1
0.01
10
0.1
0.3 0.6 0.9
Figure 14
PO – Output Power – W
THD+N –Total Harmonic Distortion + Noise – %
TOTAL HARMONIC DISTORTION PLUS NOISE
vs
OUTPUT POWER
f = 20 Hz
VDD = 5 V
RL = 8 Ω
CB = 1 µF
AV = –2 V/V
BTL
0.01 0.1 1
1
0.01
10
0.1
f = 1 kHz
f = 10 kHz
f = 20 kHz
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
10
0
–20
–30
20
30
f – Frequency – kHz
80
–10
180°
–180°
Gain
Phase
60°
–60°
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
Open-Loop Gain – dB
Phase
1101102103104
50
40
60
70 140°
100°
20°
–20°
–100°
–140°
VDD = 3.3 V
RL = Open
BTL
Figure 15
10
0
–20
–30 1
20
30
f – Frequency – kHz
80
–10
Gain
Phase
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
Open-Loop Gain – dB
101102103104
50
40
60
70 VDD = 5 V
RL = Open
BTL
180°
–180°
60°
–60°
Phase
140°
100°
20°
–20°
–100°
–140°
Figure 16
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
–0.5
–1
–1.5
–2
f – Frequency – Hz
–0.25
–0.75
–1.25
–1.75
0
0.5
Closed-Loop Gain – dB
0.25
0.75
130°
120°
140°
Phase
150°
160°
VDD = 3.3 V
RL = 8 Ω
PO = 250 mW
BTL
1
170°
180°
Gain
Phase
101102103104105106
Figure 17
CLOSED-LOOP GAIN AND PHASE
vs
FREQUENCY
–0.5
–1
–1.5
–2
f – Frequency – Hz
–0.25
–0.75
–1.25
–1.75
0
0.5
Closed-Loop Gain – dB
0.25
0.75
130°
120°
140°
Phase
150°
160°
VDD = 5 V
RL = 8 Ω
PO = 700 m W
BTL
1
170°
180°
Gain
Phase
101102103104105106
Figure 18
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 19
– Output Noise Voltage –VµVn
f – Frequency – Hz
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
20 1k 10k
10
1
100
20k100
VO BTL
VDD = 3.3 V
BW = 22 Hz to 22 kHz
RL = 8 Ω or 32 Ω
AV = –1 V/V
Vo+
Figure 20
– Output Noise Voltage –VµVn
f – Frequency – Hz
OUTPUT NOISE VOLTAGE
vs
FREQUENCY
20 1k 10k
10
1
100
20k100
VDD = 5 V
BW = 22 Hz to 22 kHz
RL = 8 Ω or 32 Ω
AV = –1 V/V
VO BTL
Vo+
Figure 21
PD – Output Power – mW
POWER DISSIPATION
vs
OUTPUT POWER
6000
150
100
50
0
350
PD– Power Dissipation – mW
200
250
300 RL = 8 Ω
200 400
RL = 32 Ω
BTL Mode
VDD = 3.3 V
Figure 22
PD – Output Power – mW
POWER DISSIPATION
vs
OUTPUT POWER
400 6000 1000
400
300
100
0
800
PD– Power Dissipation – mW
500
700
600
200 RL = 32 Ω
200 800
BTL Mode
VDD = 5 V RL = 8 Ω
N \
MTWV
*9 TEXAS
INSTRUMENTS
p057 OFFICE aox $553133
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
bridged-tied load
Figure 23 shows a linear audio power amplifier (APA) in a BTL configuration. The TPA701 BTL amplifier consists
of two linear amplifiers driving both ends of the load. There are several potential benefits to this differential drive
configuration but initially consider power to the load. The differential drive to the speaker means that as one side
is slewing up, the other side is slewing down, and vice versa. This, in effect, doubles the voltage swing on the
load as compared to a ground referenced load. Plugging 2 × VO(PP) into the power equation, where voltage is
squared, yields 4× the output power from the same supply rail and load impedance (see equation 1).
Power +
V(rms)2
RL
(1)
V(rms) +
VO(PP)
22
Ǹ
RL2x VO(PP)
VO(PP)
–VO(PP)
VDD
VDD
Figure 23. Bridge-Tied Load Configuration
In a typical portable handheld equipment sound channel operating at 3.3 V, bridging raises the power into an
8-Ω speaker from a singled-ended (SE, ground reference) limit of 62.5 mW to 250 mW. In sound power that is
a 6-dB improvement, which is loudness that can be heard. In addition to increased power, there are frequency
response concerns. Consider the single-supply SE configuration shown in Figure 24. A coupling capacitor is
required to block the dc offset voltage from reaching the load. These capacitors can be quite large
(approximately 33 µF to 1000 µF) so they tend to be expensive, heavy, occupy valuable PCB area, and have
the additional drawback of limiting low-frequency performance of the system. This frequency-limiting effect is
due to the high pass filter network created with the speaker impedance and the coupling capacitance and is
calculated with equation 2.
fc+1
2pRLCC
(2)
9?
T
w;
W *WVW
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
bridged-tied load (continued)
For example, a 68-µF capacitor with an 8-Ω speaker would attenuate low frequencies below 293 Hz. The BTL
configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency
performance is then limited only by the input network and speaker response. Cost and PCB space are also
minimized by eliminating the bulky coupling capacitor.
RL
CCVO(PP)
VO(PP)
VDD
–3 dB
fc
Figure 24. Single-Ended Configuration and Frequency Response
Increasing power to the load does carry a penalty of increased internal power dissipation. The increased
dissipation is understandable considering that the BTL configuration produces 4× the output power of a SE
configuration. Internal dissipation versus output power is discussed further in the thermal considerations
section.
BTL amplifier efficiency
Linear amplifiers are inefficient. The primary cause of these inefficiencies is voltage drop across the output stage
transistors. There are two components of the internal voltage drop. One is the headroom or dc voltage drop that
varies inversely to output power. The second component is due to the sinewave nature of the output. The total
voltage drop can be calculated by subtracting the RMS value of the output voltage from VDD. The internal voltage
drop multiplied by the RMS value of the supply current, IDDrms, determines the internal power dissipation of
the amplifier.
An easy-to-use equation to calculate efficiency starts out being equal to the ratio of power from the power supply
to the power delivered to the load. To accurately calculate the RMS values of power in the load and in the
amplifier, the current and voltage waveform shapes must first be understood (see Figure 25).
V(LRMS)
VOIDD
IDD(RMS)
Figure 25. Voltage and Current Waveforms for BTL Amplifiers
sz‘n
:
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
BTL amplifier efficiency (continued)
Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are very
different between SE and BTL configurations. In an SE application the current waveform is a half-wave rectified
shape, whereas in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different.
Keep in mind that for most of the waveform both the push and pull transistors are not on at the same time, which
supports the fact that each amplifier in the BTL device only draws current from the supply for half the waveform.
The following equations are the basis for calculating amplifier efficiency.
IDDrms +2VP
pRL
PSUP +VDD IDDrms +VDD 2VP
pRL
Efficiency +PL
PSUP
Efficiency of a BTL configuration +
pVP
4VDD +
pǒ2P
LRLǓ1ń2
4VDD
(3)
where
(4)
PL+VLrms2
RL+Vp2
2RL
VLrms +VP
2
Ǹ
Table 1 employs equation 4 to calculate efficiencies for three different output power levels. The efficiency of the
amplifier is quite low for lower power levels and rises sharply as power to the load is increased, resulting in a
nearly flat internal power dissipation over the normal operating range. The internal dissipation at full output
power is less than in the half-power range. Calculating the efficiency for a specific system is the key to proper
power supply design.
Table 1. Efficiency Vs Output Power in 3.3-V 8-Ω BTL Systems
OUTPUT POWER
(W) EFFICIENCY
(%) PEAK VOLTAGE
(V)
INTERNAL
DISSIPATION
(W)
0.125 33.6 1.41 0.26
0.25 47.6 2.00 0.29
0.375 58.3 2.45†0.28
†High-peak voltage values cause the THD to increase.
A final point to remember about linear amplifiers (either SE or BTL) is how to manipulate the terms in the
efficiency equation to utmost advantage when possible. In equation 4, VDD is in the denominator. This indicates
that as VDD goes down, efficiency goes up.
J; . Van/2 % VDD
f % 9x
Bias
Conlrol
M “
N
/—\
\m
*5 TEXAS
INSTRUMENTS
p057 OFFICE aox $553133 - DALLAS IEXAS 752s5
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
application schematic
Figure 26 is a schematic diagram of a typical handheld audio application circuit, configured for a gain of
–10 V/V.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
1
2
4
BYPASS
IN –
VDD/2
CI
RI
10 kΩ
CS
1 µF
CB
2.2 µF
SHUTDOWN
VO–8
GND
From System Control
3 IN+
RF
50 kΩ
–
+
–
+
Figure 26. TPA701 Application Circuit
The following sections discuss the selection of the components used in Figure 26.
component selection
gain setting resistors, RF and RI
The gain for each audio input of the TPA701 is set by resistors RF and RI according to equation 5 for BTL mode.
(5)
BTL gain +*2ǒRF
RIǓ
BTL mode operation brings about the factor 2 in the gain equation due to the inverting amplifier mirroring the
voltage swing across the load. Given that the TPA701 is a MOS amplifier, the input impedance is very high;
consequently input leakage currents are not generally a concern, although noise in the circuit increases as the
value of RF increases. In addition, a certain range of RF values is required for proper start-up operation of the
amplifier. Taken together, it is recommended that the effective impedance seen by the inverting node of the
amplifier be set between 5 kΩ and 20 kΩ. The effective impedance is calculated in equation 6.
(6)
Effective impedance +RFRI
RF)RI
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
component selection (continued)
As an example consider an input resistance of 10 kΩ and a feedback resistor of 50 kΩ. The BTL gain of the
amplifier would be –10 V/V and the effective impedance at the inverting terminal would be 8.3 kΩ, which is well
within the recommended range.
For high performance applications, metal film resistors are recommended because they tend to have lower
noise levels than carbon resistors. For values of RF above 50 kΩ, the amplifier tends to become unstable due
to a pole formed from RF and the inherent input capacitance of the MOS input structure. For this reason, a small
compensation capacitor of approximately 5 pF should be placed in parallel with RF when RF is greater than
50 kΩ. This, in effect, creates a low pass filter network with the cutoff frequency defined in equation 7.
(7)
–3 dB
fc
fc(lowpass) +1
2pRFCF
For example, if RF is 100 kΩ and CF is 5 pF, then fco is 318 kHz, which is well outside of audio range.
input capacitor, CI
In the typical application an input capacitor, CI, is required to allow the amplifier to bias the input signal to the
proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency
determined in equation 8.
(8)
–3 dB
fc
fc(highpass) +1
2pRICI
The value of CI is important to consider as it directly affects the bass (low frequency) performance of the circuit.
Consider the example where RI is 10 kΩ and the specification calls for a flat bass response down to 40 Hz.
Equation 8 is reconfigured as equation 9.
(9)
CI+1
2pRIfc
10
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
component selection (continued)
In this example, CI is 0.40 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. A further
consideration for this capacitor is the leakage path from the input source through the input network (RI, CI) and
the feedback resistor (RF) to the load. This leakage current creates a dc offset voltage at the input to the amplifier
that reduces useful headroom, especially in high gain applications. For this reason a low-leakage tantalum or
ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor
should face the amplifier input in most applications, as the dc level there is held at VDD/2, which is likely higher
than the source dc level. It is important to confirm the capacitor polarity in the application.
power supply decoupling, CS
The TPA701 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to
ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents
oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved
by using two capacitors of different types that target different types of noise on the power supply leads. For
higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 0.1 µF placed as close as possible to the device VDD lead works best. For filtering
lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio
power amplifier is recommended.
midrail bypass capacitor, CB
The midrail bypass capacitor, CB, is the most critical capacitor and serves several important functions. During
start-up or recovery from shutdown mode, CB determines the rate at which the amplifier starts up. The second
function is to reduce noise produced by the power supply caused by coupling into the output drive signal. This
noise is from the midrail generation circuit internal to the amplifier, which appears as degraded PSRR and
THD + N. The capacitor is fed from a 250-kΩ source inside the amplifier. To keep the start-up pop as low as
possible, the relationship shown in equation 10 should be maintained. This insures the input capacitor is fully
charged before the bypass capacitor is fully charged and the amplifier starts up.
(10)
10
ǒCB 250 kΩǓv1
ǒRF)RIǓCI
As an example, consider a circuit where CB is 2.2 µF, CI is 0.47 µF, RF is 50 kΩ, and RI is 10 kΩ. Inserting these
values into the equation 10 we get:
18.2 v35.5
which satisfies the rule. Bypass capacitor, CB, values of 0.1 µF to 2.2 µF ceramic or tantalum low-ESR capacitors
are recommended for the best THD and noise performance.
using low-ESR capacitors
Low-ESR capacitors are recommended throughout this applications section. A real (as opposed to ideal)
capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this
resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this
resistance, the more the real capacitor behaves like an ideal capacitor.
700 mW
*9 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
5-V versus 3.3-V operation
The TPA701 operates over a supply range of 2.5 V to 5.5 V. This data sheet provides full specifications for 5-V
and 3.3-V operation, as these are considered to be the two most common standard voltages. There are no
special considerations for 3.3-V versus 5-V operation with respect to supply bypassing, gain setting, or stability.
The most important consideration is that of output power. Each amplifier in TPA701 can produce a maximum
voltage swing of VDD – 1 V. This means, for 3.3-V operation, clipping starts to occur when VO(PP) = 2.3 V as
opposed to VO(PP) = 4 V at 5 V. The reduced voltage swing subsequently reduces maximum output power into
an 8-Ω load before distortion becomes significant.
Operation from 3.3-V supplies, as can be shown from the efficiency formula in equation 4, consumes
approximately two-thirds the supply power of operation from 5-V supplies for a given output-power level.
headroom and thermal considerations
Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions.
A typical music CD requires 12 dB to 15 dB of dynamic headroom to pass the loudest portions without distortion
as compared with the average power output. From the TPA701 data sheet, one can see that when the TPA701
is operating from a 5-V supply into a 8-Ω speaker that 700 mW peaks are available. Converting watts to dB:
PdB +10Log PW
Pref +10Log 700 mW
1W +–1.5 dB
Subtracting the headroom restriction to obtain the average listening level without distortion yields:
–1.5 dB – 15 dB = –16.5 (15 dB headroom)
–1.5 dB – 12 dB = –13.5 (12 dB headroom)
–1.5 dB – 9 dB = –10.5 (9 dB headroom)
–1.5 dB – 6 dB = –7.5 (6 dB headroom)
–1.5 dB – 3 dB = –4.5 (3 dB headroom)
Converting dB back into watts:
PW+10PdBń10 xP
ref
+22 mW (15 dB headroom)
+44 mW (12 dB headroom)
+88 mW (9 dB headroom)
+175 mW (6 dB headroom)
+350 mW (3 dB headroom)
AVERAGE OUTPUT A ...........
*5 TEXAS
INSTRUMENTS
TPA701
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS229D – NOVEMBER1998 – REVISED MAY 2003
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
headroom and thermal considerations (continued)
This is valuable information to consider when attempting to estimate the heat dissipation requirements for the
amplifier system. Comparing the absolute worst case, which is 700 mW of continuous power output with 0 dB
of headroom, against 12 dB and 15 dB applications drastically affects maximum ambient temperature ratings
for the system. Using the power dissipation curves for a 5-V, 8-Ω system, the internal dissipation in the TPA701
and maximum ambient temperatures is shown in Table 2.
Table 2. TPA701 Power Rating, 5-V, 8-Ω, BTL
PEAK OUTPUT
POWER
AVERAGE OUTPUT POWER
DISSIPATION
D PACKAGE
(SOIC) DGN PACKAGE
(MSOP)
POWER
(mW)
AVERAGE
OUTPUT
POWER DISSIPATION
(mW) MAXIMUM AMBIENT
TEMPERATURE MAXIMUM AMBIENT
TEMPERATURE
700 700 mW 675 34°C110°C
700 350 mW (3 dB) 595 47°C115°C
700 176 mW (6 dB) 475 68°C 122°C
700 88 mW (9 dB) 350 89°C 125°C
700 44 mW (12 dB) 225 111°C 125°C
Table 2 shows that the TPA701 can be used to its full 700-mW rating without any heat sinking in still air up to
110°C and 34°C for the DGN package (MSOP) and D package (SOIC) respectively.
TEXAS
INSTRUMENTS
Samples
Samples
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPA701D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 701
TPA701DGN ACTIVE HVSSOP DGN 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABA
TPA701DGNG4 ACTIVE HVSSOP DGN 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABA
TPA701DGNR ACTIVE HVSSOP DGN 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABA
TPA701DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 701
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
I TEXAS
INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
l TEXAS
INSTRUMENTS
REEL DIMENSIONS TAPE DIMENSIONS
’ I+K0 '«PI»
Reel
Diame|er
AD Dimension deSIgned Io accommodate me componem wIdIh
E0 Dimension deSIgned Io eecommodaIe me componenI Iengm
KO Dlmenslun desIgned to accommodate me componem Ihlckness
7 w OvereII wmm OHhe earner cape
i p1 Pitch between successwe cavIIy cemers
f
T Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
O O O D O O D O SprockeIHoles
,,,,,,,,,,, ‘
User Direcllon 0' Feed
Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPA701DGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPA701DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
l TEXAS
INSTRUMENTS
TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA701DGNR HVSSOP DGN 8 2500 358.0 335.0 35.0
TPA701DR SOIC D 8 2500 350.0 350.0 43.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 2
l TEXAS
INSTRUMENTS
T - Tube
height| L - Tube length
l
,g +
w-Tuhe _______________ _ ______________
width
47
— B - Alignment groove width
TUBE
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
TPA701D D SOIC 8 75 505.46 6.76 3810 4
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 3
‘J
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
Yl“‘+
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
PowerPAD VSSOP - 1.1 mm max heightDGN 8
SMALL OUTLINE PACKAGE
3 x 3, 0.65 mm pitch
4225482/A
www.ti.com
PACKAGE OUTLINE
C
6X 0.65
2X
1.95
8X 0.38
0.25
5.05
4.75 TYP
SEATING
PLANE
0.15
0.05
0.25
GAGE PLANE
0 -8
1.1 MAX
0.23
0.13
1.57
1.28
1.89
1.63
B3.1
2.9
NOTE 4
A
3.1
2.9
NOTE 3
0.7
0.4
PowerPAD VSSOP - 1.1 mm max heightDGN0008D
SMALL OUTLINE PACKAGE
4225481/A 11/2019
1
4
5
8
0.13 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187.
PowerPAD is a trademark of Texas Instruments.
TM
A 20
DETAIL A
TYPICAL
SCALE 4.000
EXPOSED THERMAL PAD
1
45
8
9
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
8X (1.4)
8X (0.45)
6X (0.65)
(4.4)
(R0.05) TYP
(2)
NOTE 9
(3)
NOTE 9
(1.22)
(0.55)
( 0.2) TYP
VIA
(1.57)
(1.89)
PowerPAD VSSOP - 1.1 mm max heightDGN0008D
SMALL OUTLINE PACKAGE
4225481/A 11/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
9. Size of metal pad may vary due to creepage requirement.
TM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
SYMM
SYMM
1
4
5
8
SOLDER MASK
DEFINED PAD
METAL COVERED
BY SOLDER MASK
SEE DETAILS
9
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
8X (1.4)
8X (0.45)
6X (0.65)
(4.4)
(R0.05) TYP
(1.57)
BASED ON
0.125 THICK
STENCIL
(1.89)
BASED ON
0.125 THICK
STENCIL
PowerPAD VSSOP - 1.1 mm max heightDGN0008D
SMALL OUTLINE PACKAGE
4225481/A 11/2019
1.33 X 1.600.175
1.43 X 1.730.15
1.57 X 1.89 (SHOWN)0.125
1.76 X 2.110.1
SOLDER STENCIL
OPENING
STENCIL
THICKNESS
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
TM
SOLDER PASTE EXAMPLE
EXPOSED PAD 9:
100% PRINTED SOLDER COVERAGE BY AREA
SCALE: 15X
SYMM
SYMM
1
45
8
METAL COVERED
BY SOLDER MASK SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
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