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U2J Dielectric, 10-50 VDC Datasheet by KEMET
E‘ectromc Components
KEII/IEI'
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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
1
One world. One KEMET
Benefits
• AEC–Q200automotivequalified
• Up to 10x increase in capacitance versus C0G
• Extremely low effective series resistance (ESR)
• Extremelyloweffectiveseriesinductance(ESL)
• High ripple current capability
• LownoisesolutionsimilartoC0G
• Retainsover99%ofnominalcapacitanceatfullratedvoltage
• Smallpredictableandlinearcapacitancechangewithrespect
to temperature
• Operatingtemperaturerangeof−55°Cto+125°C
• Capacitance up to 470 nF
• DC voltage ratings up to 100 V
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
U2J Dielectric, 10 – 100 VDC
(Commercial & Automotive Grade)
Overview
KEMETU2Jdielectricfeaturesamaximumoperating
temperatureof125°Candisconsideredstable.The
ElectronicsIndustriesAlliance(EIA)characterizesU2J
dielectricasaClassImaterial.Componentsofthis
classificationaretemperaturecompensatingandare
suitedforresonantcircuitapplicationsorthosewhereQ
andstabilityofcapacitancecharacteristicsarerequired.
U2Jisanextremelystabledielectricmaterialthatexhibits
a negligible shift in capacitance with respect to voltage
andboastsapredictableandlinearchangeincapacitance
with reference to ambient temperature with no aging
effect.Inaddition,U2Jdielectricextendstheavailable
capacitancerangeofClassIMLCCstoachievevalues
previouslyonlyavailableusingClassIIdielectricmaterials
likeX7R,X5R,Y5VandZ5U.
U2JisnotsensitivetoDCBiasascomparedtoClass
IIdielectricmaterialsandretainsover99%ofnominal
capacitanceatfullratedvoltage.KEMETautomotivegrade
capacitorsmeetthedemandingAutomotiveElectronics
Council'sAEC–Q200qualificationrequirements.
Capacitancechangeislimitedto−750±120ppm/°Cfrom
−55°Cto+125°C.Thesedevicesarelead(Pb)-free,RoHS
andREACHcompliantwithoutexceptionandarecapable
ofwithstandingmultiplepassesthroughalead(Pb)-free
solderreflowprofile.
Applications
• Wireless charging
• ResonantLLCconverters
• Powerconversion
• Pulsecircuits
• High ripple current
• Critical timing
• Decoupling
• Transient voltage suppression
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Open PDF in Adobe Reader for full functionality
Elccrmmc compmm
KEIVIEI'
summer):
7411 (EIA 0603 and smaller case srzes)
7210 (EIA 0805 and larger case srzes)
AUT07411 (EIA 0603 and smaller case sizes)
AUT07210 (EIA 0805 and larger case sizes)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Ordering Information
C1206 C104 J 3 J A C TU
Ceramic
CaseSize
(L"xW")
Specification/
Series1
Capacitance
Code(pF)
Capacitance
Tolerance2
RatedVoltage
(VDC) Dielectric FailureRate/
Design Termination Finish3Packaging/
Grade(C-Spec)
0402
0603
0805
1206
1210
1812
C =
Standard
Twosignificant
digitsand
number of
zeros.
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
8 = 10
4 = 16
3=25
5=50
1 = 100
J = U2J A=N/A C = 100% Matte Sn See
"Packaging
C-Spec
Ordering
OptionsTable"
1 Flexible termination option is available. Please see FT-CAP product bulletin C1087_U2J_FT-CAP_SMD.
2 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)
CommercialGrade
1
BulkBag/Unmarked
Notrequired(blank)
7"Reel/Unmarked
TU
13"Reel/Unmarked
7411(EIA0603andsmallercasesizes)
7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
7081
13"Reel/Unmarked/2mmpitch
2
7082
AutomotiveGrade
3
7"Reel
AUTO
13"Reel/Unmarked
AUTO7411(EIA0603andsmallercasesizes)
AUTO7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
3190
13"Reel/Unmarked/2mmpitch
2
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3 Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.
For more information see "Capacitor Marking."
ammmc compmm
KEIVIEI'
cumin:
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercialgradeproductsaresubjecttointernalqualification.Detailsregardingtestmethodsandconditionsare
referencedinTable4,Performance&Reliability.
AutomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.Details
regardingtestmethodsandconditionsarereferencedinthedocumentAEC–Q200,StressTestQualificationforPassive
Components.ForadditionalinformationregardingtheAutomotiveElectronicsCouncilandAEC–Q200,pleasevisittheir
websiteatwww.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
ammmc compmm
KEIVIEI'
crummy:
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMETautomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotification(PCN)andProductionPartApprovalProcess
warrant(PPAP).
AutomotiveproductsofferedthroughourdistributionchannelhavebeenassignedaninclusiveorderingcodeC-Spec,“AUTO.”
ThisC-Specwasdevelopedinordertobetterservesmallandmedium-sizedcompaniesthatpreferanautomotivegrade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecificationforreviewbya
KEMETengineeringspecialist.ThisC-SpecisthereforenotintendedforusebyKEMETOEMautomotivecustomersandare
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(seedetailsbelow.)
Product Change Notifi cation (PCN)
TheKEMETproductchangenotificationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
•Product/processchangesthataffectproductform,fit,function,and/orreliability
• Changes in manufacturing site
•Productobsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Productchange Obsolescence*
KEMETassigned1Yes(withapprovalandsignoff) Yes 180daysminimum
AUTO Yes(withoutapproval) Yes 90daysminimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
•Toensurethatsuppliercanmeetthemanufacturabilityandqualityrequirementsforthepurchasedparts.
•Toprovidetheevidencethatallcustomerengineeringdesignrecordsandspecificationrequirementsareproperly
understoodandfulfilledbythemanufacturingorganization.
•Todemonstratethattheestablishedmanufacturingprocesshasthepotentialtoproducethepart.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMETassigned1●●●●●
AUTO ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
●PartnumberspecificPPAPavailable
○ProductfamilyPPAPonly
ammmc compmm
KEIVIEI'
crummy:
So‘der reflow
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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402 1005 1.00(0.040)±0.05(0.002) 0.50(0.020)±0.05(0.002)
See Table 2
for thickness
0.30(0.012)±0.10(0.004) 0.30(0.012)
Solderreflow
only
0603 1608 1.60(0.063)±0.15(0.006) 0.80(0.032)±0.15(0.006) 0.35(0.014)±0.15(0.006) 0.70(0.028)
Solderwave
or
Solderreflow
0805 2012 2.00(0.079)±0.20(0.008) 1.25(0.049)±0.20(0.008) 0.50(0.02)±0.25(0.010) 0.75(0.030)
1206 3216 3.20(0.126)±0.20(0.008) 1.60(0.063)±0.20(0.008) 0.50(0.02)±0.25(0.010)
N/A
1210 3225 3.20(0.126)±0.20(0.008) 2.50(0.098)±0.20(0.008) 0.50(0.02)±0.25(0.010) Solderreflow
only
1812 4532 4.50(0.177)±0.30(0.012) 3.20(0.126)±0.30(0.012) 0.60(0.024)±0.35(0.014)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°Cto+125°C
CapacitanceChangewithReferenceto+25°Cand0VDCApplied
(TCC) −750±120ppm/°C
AgingRate(Maximum%CapacitanceLoss/DecadeHour) 0.1%
DielectricWithstandingVoltage(DWV)
250%ofratedvoltage
(5±1secondsandcharge/dischargenotexceeding50mA)
DissipationFactor(DF)MaximumLimitat25°C 0.1%
InsulationResistance(IR)Limitat25°C 1,000MΩµFor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
ammmc compmm
KEIVIEI'
crummy:
Capacitance vs. Temperature (TCC)
10% of Inmal
llmll
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Electrical Characteristics (Typical)
−15
−10
−5
0
5
10
15
−60 −40 −20 0 20 40 60 80 100 120 140
Capacitance Change (%)
Temperature (°C)
Capacitancevs.Temperature(TCC)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric RatedDC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
U2J All All 0.5
0.3%or±0.25pF
10% of Initial
limit
Elccxmmc compmm
KEIl/IEI'
crummy:
Ruled Vullage
Capacitance
Tnlevance
See Table Z In! Chi
Thickness Di men
Product Availability and Chip Thickness Codes
sinus
Ruled Vullage
wnc)
EasnSixe/
Sails
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
XX1 - Commercial Grade Only
Capacitance Cap
Code
Case Size/
Series C0402C C0603C C0805C C1206C C1210C C1812C
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 1 8 4 35
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
50
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100 pF 101 F G J K M BB BB BB BB
110 pF 111 F G J K M BB BB BB BB
120 pF 121 F G J K M BB BB BB BB
130 pF 131 F G J K M BB BB BB BB
150pF 151 F G J K M BB BB BB BB
160 pF 161 F G J K M BB BB BB BB
180 pF 181 F G J K M BB BB BB BB
200 pF 201 F G J K M BB BB BB BB
220 pF 221 F G J K M BB BB BB BB
240 pF 241 F G J K M BB BB BB BB
270 pF 271 F G J K M BB BB BB BB
300 pF 301 F G J K M BB BB BB BB
330 pF 331 F G J K M BB BB BB BB
360 pF 361 F G J K M BB BB BB BB
390 pF 391 F G J K M BB BB BB BB
430 pF 431 F G J K M BB BB BB BB
470 pF 471 F G J K M BB BB BB BB
510pF 511 F G J K M BB BB BB BB
560pF 561 F G J K M BB BB BB BB
620 pF 621 F G J K M BB BB BB BB
680 pF 681 F G J K M BB BB BB BB
750pF 751 F G J K M BB BB BB BB
820 pF 821 F G J K M BB BB BB BB
910 pF 911 F G J K M BB BB BB BB
1,000pF 102 F G J K M BB BB BB BB CF CF CF CF
1,100pF 112 F G J K M BB BB BB BB CF CF CF CF
1,200pF 122 F G J K M BB BB BB BB CF CF CF CF
1,300pF 132 F G J K M BB BB BB BB CF CF CF CF
1,500pF 152 F G J K M BB BB BB BB CF CF CF CF
1,600pF 162 F G J K M BB BB BB BB CF CF CF CF
1,800pF 182 F G J K M BB BB BB BB CF CF CF CF
2,000pF 202 F G J K M BB BB BB CF CF CF CF
2,200pF 222 F G J K M BB BB BB CF CF CF CF
2,400pF 242 FG J K M CF CF CF CF
2,700pF 272 F G J K M CF CF CF CF
Capacitance Cap
Code
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
50
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 1 8 4 35
Case Size/
Series
C0402C C0603C C0805C C1206C C1210C C1812C
Elccxmmc compmm
KEIl/IEI'
crummy:
Rated Vullage
Capacitance
Tnlevance
See Table Z In! Chi
Thickness Di men
Product Availability and Chip Thickness Codes
sions
Rated Vullage
wnc)
nasasize/
Sails
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont.
XX1 - Commercial Grade Only
Capacitance Cap
Code
Case Size/
Series C0402C C0603C C0805C C1206C C1210C C1812C
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 1 8 4 35
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
50
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
3,000pF 302 F G J K M CF CF CF CF
3,300pF 332 F G J K M CF CF CF CF
3,600pF 362 F G J K M CF CF CF CF
3,900pF 392 F G J K M CF CF CF CF
4,300pF 432 F G J K M CF CF CF CF
4,700pF 472 F G J K M CF CF CF CF DN DN DN DN
5,100pF 512 F G J K M CF CF CF CF DN DN DN DN
5,600pF 562 F G J K M CF CF CF CF DN DN DN DN
6,200pF 622 F G J K M CF CF CF CF DN DN DN DN
6,800pF 682 F G J K M CF CF CF CF DN DN DN DN
7,500pF 752 F G J K M CF CF CF CF DN DN DN DN
8,200pF 822 F G J K M CF CF CF CF DN DN DN DN
9,100pF 912 F G J K M CF CF CF CF DN DN DN DN
10,000pF 103 F G J K M CF CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB FB
12,000pF 123 F G J K M CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB FB
15,000pF 153 F G J K M CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB FB
18,000pF 183 F G J K M DN DN DN DN EB EB EB EB FB FB FB FB FB
22,000pF 223 F G J K M DN DN DN DP EB EB EB EB FB FB FB FB FB
27,000pF 273 F G J K M DP DP DP DP EB EB EB EB FB FB FB FB FB
33,000pF 333 F G J K M DP DP DP DG EB EB EB EB FB FB FB FB FC GB GB GB
39,000pF 393 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB FC GB GB GB
47,000pF 473 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB FC GB GB GB
56,000pF 563 F G J K M DG DG DG EB EB EB EC FB FB FB FB FE GB GB GB
68,000pF 683 F G J K M EC EC EC EC FB FB FB FB FG GB GB GB
82,000pF 823 F G J K M EC EC EC EE FB FB FB FB FG GB GB GB
100,000pF 104 F G J K M EC EC EC EF FB FB FB FC FG GB GB GB
120,000pF 124 F G J K M EF EF EF EH FC FC FC FE FH GB GB GB
150,000pF 154 F G J K M EF EF EF EH FE FE FE FG FT GB GB GB
180,000pF 184 F G J K M EH EH EH FG FG FG FG FI GB GB GB
220,000pF 224 F G J K M EH EH EH FG FG FG FH GB GB GB
270,000pF 274 F G J K M FH FH FH FM GB GB GB
330,000pF 334 F G J K M FM FM FM GC GC GC
390,000pF 394 F G J K M GH GH GH
470,000pF 474 F G J K M GK GK GK GN1
Capacitance Cap
Code
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
100
10
16
25
50
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 1 8 4 35
Case Size/
Series
C0402C C0603C C0805C C1206C C1210C C1812C
ammm Compancnls
KEIVIEI'
crummy:
BB
CF
DN
DP
DG
EB
EC
EE
EF
EH
FB
FC
FE
FG
FH
FM
FT
FI
GB
60
GH
GK
GM
0402
0603
0805
0805
0805
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
05020.05
00020.07"
07820.10"
09020.10"
12520.15
0.782010
0.902010
1.102010
1.202015
1.60 2 0 20
0.702010
0.902010
1.002010
12520.15
15520.15
170 2 0.20
190 2 0.20
2102020"
1.002010
1.102010
14020.15
1602020
17020.20
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4.000
4.000
4.000
4.000
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15,000
15.000
15.000
10,000
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2.500
4.000
4.000
2.500
2.500
2.000
4.000
4.000
2.500
2.500
2.000
2.000
2.000
1.500
1.000
1.000
1.000
1.000
1.000
0000
10.000
10.000
10.000
10.000
10.000
8.000
10.000
10.000
10.000
10.000
0.000
8.000
8.000
7.000
4.000
4.000
4.000
4.000
4.000
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50±0.05
10,000
50,000
0
0
CF
0603
0.80±0.07*
4,000
15,000
0
0
DN
0805
0.78±0.10*
4,000
15,000
0
0
DP
0805
0.90±0.10*
4,000
15,000
0
0
DG
0805
1.25±0.15
0
0
2,500
10,000
EB
1206
0.78±0.10
4,000
10,000
4,000
10,000
EC
1206
0.90±0.10
0
0
4,000
10,000
EE
1206
1.10±0.10
0
0
2,500
10,000
EF
1206
1.20±0.15
0
0
2,500
10,000
EH
1206
1.60±0.20
0
0
2,000
8,000
FB
1210
0.78±0.10
0
0
4,000
10,000
FC
1210
0.90±0.10
0
0
4,000
10,000
FE
1210
1.00±0.10
0
0
2,500
10,000
FG
1210
1.25±0.15
0
0
2,500
10,000
FH
1210
1.55±0.15
0
0
2,000
8,000
FM
1210
1.70±0.20
0
0
2,000
8,000
FT
1210
1.90±0.20
0
0
2,000
8,000
FI
1210
2.10±0.20*
0
0
1,500
7,000
GB
1812
1.00±0.10
0
0
1,000
4,000
GC
1812
1.10±0.10
0
0
1,000
4,000
GH
1812
1.40±0.15
0
0
1,000
4,000
GK
1812
1.60±0.20
0
0
1,000
4,000
GN
1812
1.70±0.20
0
0
1,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm tape and reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
BulkBag(default)
PackagingC-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
150,000
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included
in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial grade
product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for
automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-static bulk bag and automotive grade products). The 15th
through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk
Bag" packaging.
E‘ucuomc Compcnonu
KEIWEI'
CHARGED!
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc
Emma):
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
•SolderwaveorsolderreflowforEIAcasesizes0603,0805,and1206
•AllotherEIAcasesizesarelimitedtosolderreflowonly
Recommended Reflow Soldering Profile:
TheKEMETfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/J-
STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpassesat
theseconditions.
Profile Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax 60–120seconds 60–120seconds
Ramp-UpRate(TL to TP)3°C/second
maximum
3°C/second
maximum
LiquidousTemperature(TL)183°C 217°C
TimeAboveLiquidous(tL)60–150seconds 60–150seconds
PeakTemperature(TP)235°C 260°C
TimeWithin5°CofMaximum
PeakTemperature(tP)
20seconds
maximum
30seconds
maximum
Ramp-DownRate(TP to TL)
6°C/second
maximum
6°C/second
maximum
Time25°CtoPeak
Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Electronic Componcnls
KEIl/IEI'
EHARGED!
5 N (051 kg)
Load humidity: 1,000 hours BET/05% RH and rated voltage. Add 100 K ohm resisior.
Measurement a1 24 hours 24 hours aitertest conclusion.
Low volt humidity: 1,000 hours EST/55% RH and 1.5 V. Add 100 K ohm resistor.
Measurement a1 24 hours 24 hours aitertest conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required. Measurement a124 hours 14 hours alter
tesi conclusion.
755"C/+125’C. Note: Number of cycles required 7 300. Maximum iranslertime 7 20
seconds. Dwell time 715 minutes, Air 7 air.
M|L7STD7202
Method 108/EIA 7198
5 G‘s lor 20 minutes, 12 cycles each at 3 orientations. Noie: Use 8" X 5" PCB 0.031“ thick
7 secure poims on one long side and 2 secure poims at corners of
mounted wnhin 2" from any secure point, Test from 10 7 2,000 Hz.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS-C-6429 Appendix1,Note:
BoardFlex JIS-C-6429 Appendix2,Note:3.0mm(minimum).
Solderability J-STD-002
Magnification50XConditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°C,category3
c)MethodDat260°C,category3
Temperature Cycling JESD22MethodJA-104 1,000cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
BiasedHumidity MIL-STD-202Method103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Moisture Resistance MIL-STD-202Method106
t=24hours/cycle.Steps7aand7bnotrequired.Measurementat24hours±4hoursafter
testconclusion.
Thermal Shock MIL-STD-202Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.Dwelltime–15minutes.Air–air.
HighTemperatureLife
MIL-STD-202
Method108/EIA-198
1,000hoursat125°Cwith2Xratedvoltageapplied.
StorageLife MIL-STD-202Method108 125°C,0VDCfor1,000hours.
Vibration MIL-STD-202Method204
5G'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz.
Mechanical Shock MIL-STD-202Method213 Figure1ofMethod213,ConditionF.
Resistance to Solvents MIL-STD-202Method215 Addaqueouswashchemical,OKEMcleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
Package Size (L" x W") Force Duration
0402
5N(0.51kg)
60seconds
0603
10N(1.02kg)
≥0805
18N(1.83kg)
cccccccccccccccccccc
CHARGED!
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Capacitor Marking (Optional):
Lasermarkingoptionisnotavailableon:
• C0G,U2J,UltraStableX8R,andY5Vdielectricdevices
• EIA0402casesizedevices
• EIA0603casesizedeviceswithflexibleterminationoption
• KPScommercialandautomotivegradestackeddevices
Thesecapacitorsaresuppliedunmarkedonly.
ammm Compancnls
KEIVIEI'
Emma):
Bmm.12mm
180mm (700») mmmm camenape
KPS1812
and 2220
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7"Reel 13"Reel 7"Reel 13"Reel
Pitch(P
1
)* Pitch(P
1
)*
01005–0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805–1808 12 4 4
≥1812 12 8 8
KPS1210 12 8 8
KPS1812
and2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotivegrade7"reelunmarked
C-3191
Automotivegrade13"reelunmarked
C-7081
Commercialgrade7"reelunmarked
C-7082
Commercialgrade13"reelunmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lowerplacementcosts.
• Double the parts on each reel results in fewer reel
changesandincreasedefficiency.
• Fewerreelsresultinlowerpackaging,shippingand
storagecosts,reducingwaste.
Eiecxmmc Compancnls
KEIVIEI'
EHARGED:
‘ ,
mum:
nulhmaeling
DY Minimum R Reierence SY Minimum T T‘
Note 1 Note 2 Note 3 Maximum Maximum
i3Y Maximum E2 T2 W
Nole4 Minimum Maximum Maximum
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
TapeSize D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
TapeSize Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0&K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note512 mm Single (4 mm)
anddouble(8mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls
KEIVI
mam):
T - V 1 f
¢¢§9
W \
+7: Tiifi‘eri
/ #4 j/ l ‘X J x
—
RRefevence
NmeZ
0.10
(0.904)
maXImum
(afiiflig (0237)
4.0 10.10 3.3
(0.157 :a 004) (0.327)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
TapeSize D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
TapeSize Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5±0.05
(0.138±0.002)
2.0±0.05
(0.079±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0±0.10
(0.157±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc
Emma):
e 7/////////////////////l‘
e
O
@379
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force:1.0kgminimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1to1.0newton(10to100gf)
12and16mm 0.1to1.3newton(10to130gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300±10mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls
KEIVIEI'
Emma):
0.4 mes/+0.0
(0331 +0 059400)
12.4 +2 0/00
(0.40:; +0 070/0 0)
15.4 +2.0/+0.0
(0.646 +0 070/0 0)
14.4
(0 567)
10.4
(0.724)
22.4
(0 882)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
TapeSize A B Minimum CD Minimum
8 mm 178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
TapeSize N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
EHARGED!
1
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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm
KEIVIEI'
cumin:
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 05/24/19
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checkingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.AllInformationgiven
hereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
TheInformationisintendedforuseonlybycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.Any
technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumes
noobligationorliabilityfortheadvicegivenorresultsobtained.
AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponent
failuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjury
orpropertydamage.
Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatother
measuresmaynotberequired.
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