Given these two extremes of the operating load resistance (RM), the
load
3 This
specifically
designed; 1) the extra inductor (L1), 2] the shunt capacitor (Cm) and, 3) the
less
by
within
the frequency capability of this development board. The design needs to
have a specific load resistance (RM) value and desired load power (PM
that is used to begin the design, which then drives the values of the other
impedance value (Ztml shown in figure 1.The reactive component of Zmad
supply
the
external
by
0530
C
Finally,the choke lel can be designed using equation 5 and, in this case,
current,
which can lead to a more stable operating amplifier. A toorlow value Will
lead to increased operating lossesand changethe mode ofoperation olthe
QUICK START GUIDE
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EPC9053
Given these two extremes of the operating load resistance (RLoad), the
optimal point between them must be determined. In this case, the
optimal point yields the same device losses for each of the extreme load
resistance points and is shown in the lower center graph of figure 3. This
optimal design point can be found through trial and error, or using circuit
simulation.
Class-E amplifier design
For this amplifier only three components need to be specifically
designed; 1) the extra inductor (Le), 2) the shunt capacitor (Csh) and, 3) the
selection of a suitable switching device. The RF choke (LRFck) value is less
critical and hence can be chosen or designed.
The design equations for the Class-E amplifier have been derived by
N. Sokal [1]. To simplify these equations, the value of QL in [1] is set to in-
finity, which is a reasonable approximation in most applications within
the frequency capability of this development board. The design needs to
have a specific load resistance (RLoad) value and desired load power (PLoad)
that is used to begin the design, which then drives the values of the other
components, including the magnitude of the supply voltage.
The Class-E amplifier passive component design starts with the load
impedance value (ZLoad) shown in figure 1. The reactive component of ZLoad
is tuned out using a series capacitor CS, which also serves as a DC block,
resulting in RLoad. It is a common mistake to ignore the need for the DC
block, where a failure to do so can yield a DC current from the supply
through to the load, and lead to additional losses in several components
in that path.
First, using the equations in figure 4, both the extra inductor
Le (equation 2 and shunt capacitor (equation 3) values can be
determined [2], [3]. The value of the shunt capacitor includes the
COSS of the switching device, which must be subtracted from the
calculated value to yield the actual external capacitor (Csh) value. To
do this, first the magnitude of the supply voltage (VDD) is calculated
using equation 1, which in turn can be used to determine the peak
device voltage (3.56·VDD).
The RMS value of the peak device voltage is then used to determine the
COSSQ of the device at that voltage. This is the capacitance that will be
deducted from the calculated shunt capacitor to reveal the external
shunt capacitor (Csh) value. The COSSQ of the device can be calculated by
integrating the COSS as function of voltage using equation 4. If the COSSQ
value is larger than the calculated shunt capacitance, then the design
cannot be realized for the load resistance specified and a new load
resistance (RLoad) must be chosen.
Finally, the choke (LRFck) can be designed using equation 5 and, in this case,
a minimum value is specified. Larger values yield lower ripple current,
which can lead to a more stable operating amplifier. A too-low value will
lead to increased operating losses and change the mode of operation of the
amplifier. In some cases this can be intentional.
Here:
RLoad = Load Resistance [Ω]
PLoad = Load Power [W]
VDD = Amplifier Supply Voltage [V]
f = Operating Frequency [Hz]
Le = Extra Inductor [H]
Csh = Shunt Capacitor [F]
COSS = Output Capacitance of the FET [F]
COSSQ = Charge Equivalent Device Output Capacitance [F].
VDS = Drain-Source Voltage of the FET [V]
LRFck = RF Choke Inductor [H]
CS = Series Tuning Capacitor [F]
ZLoad = Load Impedance [Ω]
NOTE. that in the case of a differential mode amplifier the calculated value
of Le is shared between each of the circuits and thus must be divided by
two for each physical component on the board.
[1] N.O. Sokal, “Class-E RF Power Amplifiers,” QEX, Issue 204, pp. 9–20,
January/ February 2001.
[2] M. Kazimierczuk, “Collector amplitude modulation of the Class-E
tuned power amplifier,” IEEE Transactions on Circuits and Systems,
June 1984, Vol.31, No. 6, pp. 543–549.
[3] Z. Xu, H. Lv, Y. Zhang, Y. Zhang, “Analysis and Design of Class-E Power
Amplifier employing SiC MESFETs,“ IEEE International Conference on
Electron Devices and Solid-State Circuits (EDSSC) 2009, 25–27
December 2009, pp 28–31.
QUICK START PROCEDURE
The EPC9053 amplifier board is easy to set up to evaluate the
performance of the eGaN FET in a class-E amplifier application. Once
the design of the passive components has been completed and
installed, then the board can be powered up and tested.
1. Make sure the entire system is fully assembled prior to making
electrical connections including an applicable load.
2. With power off, connect the main input power supply bus to J62
as shown in figure 5. Note the polarity of the supply connector.
Set the voltage to 0 V.
3. With power off, connect the logic input power supply bus to J90
as shown in figure 5. Note the polarity of the supply connector.
Set the voltage to between 7 V and 12 V.
4. Make sure all instrumentation is connected to the system.
This includes the external oscillator to control the circuit.
5. Turn on the logic supply voltage.
6. Turn on the main supply voltage and increase to the desired
value. Note operating conditions and in particular the thermal
performance and voltage of the FETs to prevent
over-temperature and over-voltage failure.
7. Once operation has been confirmed, observe the device voltage,
efficiency and other parameters on both the amplifier and
device boards.
8. For shutdown, please follow steps in the reverse order.