Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
4808-3004-CP Datasheet 4808-3004-CP - 3M 3M5473-ND CONN IC DIP SOCKET 8POS TIN 21.029 - Immediate Available: 21.029 kr. 3,35000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4828-3004-CP Datasheet 4828-3004-CP - 3M 3M5480-ND CONN IC DIP SOCKET 28POS TIN 10.083 - Immediate Available: 10.083 kr. 5,05000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1TR-ND CONN SOCKET PLCC 44POS TIN 9.360 - Immediate Available: 9.360 kr. 9,57231 360 Minimum: 360 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1CT-ND CONN SOCKET PLCC 44POS TIN 9.779 - Immediate Available: 9.779 kr. 14,96000 1 Minimum: 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1DKR-ND CONN SOCKET PLCC 44POS TIN 9.779 - Immediate Available: 9.779 Digi-Reel® 1 Minimum: 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TP Datasheet 8444-21B1-RK-TP - 3M 3M4421B1-ND CONN SOCKET PLCC 44POS TIN 5.983 - Immediate Available: 5.983 kr. 11,35000 1 Minimum: 1 Tube? 8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8468-11B1-RK-TP Datasheet 8468-11B1-RK-TP - 3M 3M6811B1-ND CONN SOCKET PLCC 68POS TIN 3.174 - Immediate Available: 3.174 kr. 15,02000 1 Minimum: 1 Tube? 8400 Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 139 - Immediate Available: 139 kr. 122,67000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 602 - Immediate Available: 602 kr. 131,79000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 906 - Immediate Available: 906 kr. 132,25000 1 Minimum: 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 711 - Immediate Available: 711 kr. 149,63000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-5248-00-0602J Datasheet 224-5248-00-0602J - 3M 3M5000-ND CONN IC DIP SOCKET ZIF 24POS GLD 118 - Immediate Available: 118 kr. 158,16000 1 Minimum: 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 550 - Immediate Available: 550 kr. 173,58000 1 Minimum: 1 Bulk? Textool™ Active SOIC 8 (2 x 4)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 485 - Immediate Available: 485 kr. 193,19000 1 Minimum: 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
210-2599-00-0602 Datasheet 210-2599-00-0602 - 3M 3M5061-ND CONN SOCKET SIP ZIF 10POS GOLD 131 - Immediate Available: 131 kr. 234,39000 1 Minimum: 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 143 - Immediate Available: 143 kr. 248,56000 1 Minimum: 1 Bulk? Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
228-7396-55-1902 Datasheet 228-7396-55-1902 - 3M 3M5059-ND CONN SOCKET SOIC 28POS GOLD 343 - Immediate Available: 343 kr. 262,40000 1 Minimum: 1 Bulk? Textool™ Active SOIC 28 (2 x 14)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
220-2600-00-0602 Datasheet 220-2600-00-0602 - 3M 3M5062-ND CONN SOCKET SIP ZIF 20POS GOLD 110 - Immediate Available: 110 kr. 266,93000 1 Minimum: 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
200-6311-9UN-1900 Datasheet 200-6311-9UN-1900 - 3M 3M5067-ND CONN SOCKET PGA ZIF 121POS GOLD 315 - Immediate Available: 315 kr. 280,57000 1 Minimum: 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
200-6315-9UN-1900 Datasheet 200-6315-9UN-1900 - 3M 3M5069-ND CONN SOCKET PGA ZIF 225POS GOLD 198 - Immediate Available: 198 kr. 478,49000 1 Minimum: 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm)
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0.100" (2.54mm)
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Polyethersulfone (PES) -55°C ~ 150°C
264-5205-01 Datasheet 264-5205-01 - 3M 3M10833-ND CONN SOCKET QFN 64POS GOLD 72 - Immediate Available: 72 kr. 701,13000 1 Minimum: 1 Bulk? Textool™ Active QFN 64 (4 x 16) 0.020" (0.50mm) Gold
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Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold
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Beryllium Copper Polyethersulfone (PES)
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200-6325-9UN-1900 Datasheet 200-6325-9UN-1900 - 3M 3M5073-ND CONN SOCKET PGA ZIF 625POS GOLD 42 - Immediate Available: 42 kr. 732,36000 1 Minimum: 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
288-4205-01 Datasheet 288-4205-01 - 3M 3M10839-ND CONN SOCKET QFN 88POS GOLD 39 - Immediate Available: 39 kr. 885,53000 1 Minimum: 1 Tray? Textool™ Active QFN 88 (4 x 22) 0.016" (0.40mm) Gold
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Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold
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Beryllium Copper Polyethersulfone (PES)
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4808-3000-CP Datasheet 4808-3000-CP - 3M 3M5461-ND CONN IC DIP SOCKET 8POS TIN 22.143 - Immediate Available: 22.143 kr. 3,35000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND CONN IC DIP SOCKET 16POS TIN 9.932 - Immediate Available: 9.932 kr. 3,35000 1 Minimum: 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
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13:36:31 12-10-2018