Product Index > Connectors, Interconnects > Sockets for ICs, Transistors

Results: 242       242 Remaining
PackagingSeriesPart StatusTypeNumber of Positions or Pins (Grid)Pitch - MatingContact Finish - MatingContact Finish Thickness - MatingContact Material - MatingMounting TypeFeaturesTerminationPitch - PostContact Finish - PostContact Finish Thickness - PostContact Material - PostHousing MaterialOperating Temperature
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Packaging Series Part Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
   
4808-3004-CP Datasheet 4808-3004-CP - 3M 3M5473-ND CONN IC DIP SOCKET 8POS TIN 22.346 - Immediate
kr. 2,93000 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4816-3000-CP Datasheet 4816-3000-CP - 3M 3M5463-ND CONN IC DIP SOCKET 16POS TIN 19.683 - Immediate
kr. 2,93000 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
4828-3004-CP Datasheet 4828-3004-CP - 3M 3M5480-ND CONN IC DIP SOCKET 28POS TIN 12.006 - Immediate
kr. 4,45000 1 Tube? 4800 Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1TR-ND CONN SOCKET PLCC 32POS TIN 3.600 - Immediate
kr. 7,06991 450 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1CT-ND CONN SOCKET PLCC 32POS TIN 4.842 - Immediate
kr. 11,04000 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8432-21B1-RK-TR Datasheet 8432-21B1-RK-TR - 3M 3M3221B1DKR-ND CONN SOCKET PLCC 32POS TIN 4.842 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1TR-ND CONN SOCKET PLCC 44POS TIN 4.680 - Immediate
kr. 8,46069 360 Tape & Reel (TR)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1CT-ND CONN SOCKET PLCC 44POS TIN 4.740 - Immediate
kr. 13,24000 1 Cut Tape (CT)?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TR Datasheet 8444-21B1-RK-TR - 3M 3M4421B1DKR-ND CONN SOCKET PLCC 44POS TIN 4.740 - Immediate
Digi-Reel® 1 Digi-Reel®?
Alternate Packaging
8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TP Datasheet 8444-21B1-RK-TP - 3M 3M4421B1-ND CONN SOCKET PLCC 44POS TIN 2.733 - Immediate
kr. 10,07000 1 Tube? 8400 Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
214-3339-00-0602J Datasheet 214-3339-00-0602J - 3M 3M1402-ND CONN IC DIP SOCKET ZIF 14POS GLD 833 - Immediate
kr. 108,64000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-3342-00-0602J Datasheet 220-3342-00-0602J - 3M 3M2002-ND CONN IC DIP SOCKET ZIF 20POS GLD 729 - Immediate
kr. 115,53000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-1275-00-0602J Datasheet 224-1275-00-0602J - 3M 3M2402-ND CONN IC DIP SOCKET ZIF 24POS GLD 636 - Immediate
kr. 116,69000 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-3340-00-0602J Datasheet 216-3340-00-0602J - 3M 3M1602-ND CONN IC DIP SOCKET ZIF 16POS GLD 1.599 - Immediate
kr. 117,06000 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-1277-00-0602J Datasheet 228-1277-00-0602J - 3M 3M2802-ND CONN IC DIP SOCKET ZIF 28POS GLD 213 - Immediate
kr. 117,36000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1280-00-0602J Datasheet 240-1280-00-0602J - 3M 3M4002-ND CONN IC DIP SOCKET ZIF 40POS GLD 541 - Immediate
kr. 132,49000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
208-7391-55-1902 Datasheet 208-7391-55-1902 - 3M 3M5054-ND CONN SOCKET SOIC 8POS GOLD 414 - Immediate
kr. 153,72000 1 Bulk? Textool™ Active SOIC 8 (2 x 4)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
248-1282-00-0602J Datasheet 248-1282-00-0602J - 3M 3M5004-ND CONN IC DIP SOCKET ZIF 48POS GLD 925 - Immediate
kr. 166,65000 1 Tube? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-7224-55-1902 Datasheet 216-7224-55-1902 - 3M 3M5077-ND CONN SOCKET SOIC 16POS GOLD 350 - Immediate
kr. 171,11000 1 Bulk? Textool™ Active SOIC 16 (2 x 8)
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Gold
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Beryllium Copper Through Hole Closed Frame Solder
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Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
210-2599-00-0602 Datasheet 210-2599-00-0602 - 3M 3M5061-ND CONN SOCKET SIP ZIF 10POS GOLD 107 - Immediate
kr. 207,52000 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-1288-00-0602J Datasheet 240-1288-00-0602J - 3M 3M4006-ND CONN IC DIP SOCKET ZIF 40POS GLD 271 - Immediate
kr. 211,06000 1 Bulk? Textool™ Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
203-2737-55-1102 Datasheet 203-2737-55-1102 - 3M 3M10849-ND CONN TRANSIST TO-3/TO-66 3POS 120 - Immediate
kr. 220,09000 1 Bulk? Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular)
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Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234" (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 150°C
220-2600-00-0602 Datasheet 220-2600-00-0602 - 3M 3M5062-ND CONN SOCKET SIP ZIF 20POS GOLD 156 - Immediate
kr. 236,31000 1 Bulk? Textool™ Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold
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Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
200-6311-9UN-1900 Datasheet 200-6311-9UN-1900 - 3M 3M5067-ND CONN SOCKET PGA ZIF 121POS GOLD 225 - Immediate
kr. 270,41000 1 Bulk? Textool™ Active PGA, ZIF (ZIP) 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole
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Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
264-5205-01 Datasheet 264-5205-01 - 3M 3M10833-ND CONN SOCKET QFN 64POS GOLD 54 - Immediate
kr. 620,98000 1 Bulk? Textool™ Active QFN 64 (4 x 16) 0.020" (0.50mm) Gold
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Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold
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Beryllium Copper Polyethersulfone (PES)
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11:43:09 5-21-2018