Ther-O-Link™ Thermal Compound
Aavid, Thermal Division of Boyd Corporation
Ther-O-Link™ is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-Link™ substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions.
- White thermal compound
- Shelf Life:24 Months
- Shelf Life Start:Date of Manufacture
- Size / Dimension:2 oz Tube
- Type:Silicone Compound