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Aavid, Thermal Division of Boyd Corporation
Sil-Free™ Series
Aavid, Thermal Division of Boyd Corporation
Ther-O-Link™ Series
 
Aavid, Thermal Division of Boyd Corporation
Ultrastick™ Series
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Ther-O-Link™ Series

Ther-O-Link™ Thermal Compound

Aavid, Thermal Division of Boyd Corporation

Ther-O-Link™ is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-Link™ substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions.

Features
  • White thermal compound
Specifications
  • Color:White
  • Shelf Life:24 Months
  • Shelf Life Start:Date of Manufacture
  • Size / Dimension:2 oz Tube
  • Thermal Conductivity:0.73 W/m-K
  • Type:Silicone Compound
  • Usable Temperature Range:-40°F ~ 392°F (-40°C ~ 200°C)
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