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Product Overview
Digi-Key Part Number 294-1104-ND
Quantity Available 1.608
Can ship immediately
Manufacturer

Manufacturer Part Number

BDN18-3CB/A01

Description HEATSINK CPU W/ADHESIVE 1.81"SQ
Expanded Description Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 12 Weeks
Documents & Media
Datasheets Various Semiconductor Heat Sink
A01 Laminating Adhesive
RoHS Information BDN Series RoHS Cert
Catalog Page 2403 (EU2011-EN PDF)
Product Attributes Select All
Categories
Manufacturer

CTS Thermal Management Products

Series BDN
Part Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.81" (45.97mm)
Width 1.810" (45.97mm)
Diameter -
Height Off Base (Height of Fin) 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 3.5°C/W @ 400 LFM
Thermal Resistance @ Natural 10.8°C/W
Material Aluminum
Material Finish Black Anodized
 
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Additional Resources
Standard Package ? 1.000
Other Names 294-1104
BDN183CB/A01

08:48:02 3-25-2017

Price & Procurement
 

Quantity
All prices are in DKK.
Price Break Unit Price Extended Price
1 28,07000 28,07
10 27,33500 273,35
25 26,59440 664,86
50 25,11600 1.255,80
100 23,63830 2.363,83
250 22,16116 5.540,29
500 21,42252 10.711,26
1.000 19,20639 19.206,39

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