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Product Overview
Digi-Key Part Number BER169-ND
Quantity Available 8.420
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-90

Description THERM PAD TO-218 W/ADH HI-FLOW
Expanded Description Thermal Pad Gray 21.84mm x 18.79mm Rectangle Adhesive - One Side
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
RoHS Information Hi-Flow 115-AC Material Report
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2401 (EU2011-EN PDF)
Product Attributes Select All
Categories
Manufacturer

Bergquist

Series Hi-Flow® 115-AC
Part Status Active
Usage TO-218, TO-220, TO-247
Shape Rectangle
Outline 21.84mm x 18.79mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER169
BG428814
HF115AC-90
HF115AC00055AC90
HF115TAAC-90

09:49:00 3-23-2017

Price & Procurement
 

Quantity
All prices are in DKK.
Price Break Unit Price Extended Price
1 0,70000 0,70
10 0,60900 6,09
50 0,54600 27,30
100 0,48300 48,30
500 0,42000 210,00
1.000 0,31500 315,00
5.000 0,27300 1.365,00

Submit a request for quotation on quantities greater than those displayed.

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